Inventor

DINKEL MARKUS

DE28 patents

⚠️ This page may combine multiple inventors who share the name “DINKEL MARKUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DINKEL MARKUS

INFINEON TECHNOLOGIES AG

Module with integrated power electronic circuitry and logic circuitry

Semiconductor package having a source-down configured transistor die and a drain-down configured transistor die

Overmolded substrate-chip arrangement with heat sink

Semiconductor package with mold lock vent

Plurality of transistor packages with exposed source and drain contacts mounted on a carrier

Semiconductor package with integrated magnetic field sensor

Power package with integrated magnetic field sensor

Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element

Leadframe leads having fully plated end faces

Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto

Semiconductor device and method for manufacturing a semiconductor device

Method of manufacturing a package using a clip having at least one locking recess

Clip having locking recess for connecting an electronic component with a carrier in a package

Leadframe leads having fully plated end faces

Electronic device including a metal substrate and a semiconductor module embedded in a laminate

Semiconductor device including lead frames with downset

Semiconductor device and method for manufacturing a semiconductor device

Electronic module having an electrically insulating structure with material having a low modulus of elasticity

INFINEON TECHNOLOGIES AUSTRIA AG

Semiconductor package and method of fabricating a semiconductor package

SMD package with top side cooling

Method of fabricating a semiconductor package

Method of producing an SMD package with top side cooling

SMD package with flat contacts to prevent bottleneck

SAP AG

Recording application user actions for application testing

OTREMBA RALF

Semiconductor module including semiconductor chips coupled to external contact elements

SCHAEFFLER TECHNOLOGIES AG

Method for producing a rolling bearing component

GOLLER BERND

Method of fabricating a semiconductor package with mold lock opening

BISCHOF JORG

Non-client-specific testing of applications