Inventor

NIITANI Miho

JP2 patents

Patents

2 patents

US10763127B2Sep 1, 2020

Heat treatment method for semiconductor wafer

SHINETSU HANDOTAI KK3 citations64

US11495488B2Nov 8, 2022

Method for manufacturing bonded SOI wafer and bonded SOI wafer

SHINETSU HANDOTAI KK0 citations48