Inventor
WAKABAYASHI TAISHI
JP5 patents
Patents
5 patentsUS10460983B2Oct 29, 2019
Method for manufacturing a bonded SOI wafer
SHINETSU HANDOTAI KK2 citations70
US10763127B2Sep 1, 2020
Heat treatment method for semiconductor wafer
SHINETSU HANDOTAI KK3 citations64
US10529615B2Jan 7, 2020
Method for manufacturing a bonded SOI wafer and bonded SOI wafer
SHINETSU HANDOTAI KK1 citations58
US11495488B2Nov 8, 2022
Method for manufacturing bonded SOI wafer and bonded SOI wafer
SHINETSU HANDOTAI KK0 citations48
US10566196B2Feb 18, 2020
Method for manufacturing bonded SOI wafer
SHINETSU HANDOTAI KK0 citations36