Inventor
KIEWRA EDWARD W
US43 patents
⚠️ This page may combine multiple inventors who share the name “KIEWRA EDWARD W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
28 patentsUS6383920B1May 7, 2002
Process of enclosing via for improved reliability in dual damascene interconnects
IBM179 citations98
US6420749B1Jul 16, 2002
Trench field shield in trench isolation
IBM48 citations93
US7560375B2Jul 14, 2009
Gas dielectric structure forming methods
IBM34 citations92
US7102204B2Sep 5, 2006
Integrated SOI fingered decoupling capacitor
IBM24 citations92
US6486526B1Nov 26, 2002
Crack stop between neighboring fuses for protection from fuse blow damage
IBM42 citations92
US7964896B2Jun 21, 2011
Buried channel MOSFET using III-V compound semiconductors and high k gate dielectrics
IBM13 citations84
US7129557B2Oct 31, 2006
Autonomic thermal monitor and controller for thin film devices
IBM11 citations83
US6380027B2Apr 30, 2002
Dual tox trench dram structures and process using V-groove
IBM10 citations74
US10103280B1Oct 16, 2018
Rapid melt growth photodetector
IBM3 citations73
US9343545B2May 17, 2016
Electrical coupling of memory cell access devices to a word line
IBM3 citations73
US7674675B2Mar 9, 2010
Method of forming an integrated SOI fingered decoupling capacitor
IBM7 citations73
US7078259B2Jul 18, 2006
Method for integrating thermistor
IBM7 citations73
US6268638B1Jul 31, 2001
Metal wire fuse structure with cavity
IBM8 citations73
US9678273B2Jun 13, 2017
Device for propagating light and method for fabricating a device
IBM3 citations72
US9658400B2May 23, 2017
Method for fabricating a device for propagating light
IBM3 citations72
US9304335B2Apr 5, 2016
Integrated LDMOS devices for silicon photonics
IBM2 citations63
US9036959B2May 19, 2015
Intergrating a silicon photonics photodetector with CMOS devices
IBM3 citations63
US7287325B2Oct 30, 2007
Method of forming interconnect structure or interconnect and via structures using post chemical mechanical polishing
IBM3 citations63
US11143953B2Oct 12, 2021
Protection of photomasks from 193nm radiation damage using thin coatings of ALD Al2O3
IBM0 citations61
US9882021B2Jan 30, 2018
Planar III-V field effect transistor (FET) on dielectric layer
IBM0 citations52
US9299804B2Mar 29, 2016
Electrical coupling of memory cell access devices to a word line
IBM1 citations52
US9287115B2Mar 15, 2016
Planar III-V field effect transistor (FET) on dielectric layer
IBM1 citations52
US8809860B2Aug 19, 2014
III-V compound semiconductor material passivation with crystalline interlayer
IBM1 citations52
US9691812B2Jun 27, 2017
Photodetector and methods of manufacture
IBM0 citations51
US7361584B2Apr 22, 2008
Detection of residual liner materials after polishing in damascene process
IBM0 citations51
US9590001B2Mar 7, 2017
CMOS protection during germanium photodetector processing
IBM1 citations50
US9136303B2Sep 15, 2015
CMOS protection during germanium photodetector processing
IBM1 citations50
US7473636B2Jan 6, 2009
Method to improve time dependent dielectric breakdown
IBM0 citations42
GLOBALFOUNDRIES INC
4 patentsUS9508640B2Nov 29, 2016
Multiple via structure and method
GLOBALFOUNDRIES INC9 citations84
US9466753B1Oct 11, 2016
Photodetector methods and photodetector structures
GLOBALFOUNDRIES INC8 citations83
US9954137B2Apr 24, 2018
Photodetector and methods of manufacture
GLOBALFOUNDRIES INC0 citations51
US9882081B2Jan 30, 2018
Photodetector methods and photodetector structures
GLOBALFOUNDRIES INC0 citations51
DE SOUZA JOEL P
3 patentsUS8415772B2Apr 9, 2013
Method to prevent surface decomposition of III-V compound semiconductors
DE SOUZA JOEL P5 citations83
US8431476B2Apr 30, 2013
Method to prevent surface decomposition of III-V compound semiconductors
DE SOUZA JOEL P1 citations62
US8273649B2Sep 25, 2012
Method to prevent surface decomposition of III-V compound semiconductors
DE SOUZA JOEL P0 citations51
GLOBALFOUNDRIES US INC
3 patentsUS12405423B2Sep 2, 2025
Hybrid edge couplers with voids
GLOBALFOUNDRIES US INC1 citations62
US11611002B2Mar 21, 2023
Photodiode and/or pin diode structures
GLOBALFOUNDRIES US INC0 citations62
US11994714B2May 28, 2024
Photonic integrated circuit structure with at least one tapered sidewall liner adjacent to a waveguide core
GLOBALFOUNDRIES US INC0 citations61