Inventor
KIM JONG YOUN
KR26 patents
⚠️ This page may combine multiple inventors who share the name “KIM JONG YOUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS11404346B2Aug 2, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD7 citations83
US10847468B2Nov 24, 2020
Semiconductor package including interposer
SAMSUNG ELECTRONICS CO LTD9 citations83
US9054228B2Jun 9, 2015
Semiconductor packages including a heat spreader and methods of forming the same
SAMSUNG ELECTRONICS CO LTD12 citations83
US8912048B2Dec 16, 2014
Method of fabricating semiconductor device including a substrate attached to a carrier
SAMSUNG ELECTRONICS CO LTD8 citations83
US11710701B2Jul 25, 2023
Semiconductor package including interposer
SAMSUNG ELECTRONICS CO LTD1 citations72
US10622320B2Apr 14, 2020
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations72
US8940557B2Jan 27, 2015
Method of fabricating wafer level package
SAMSUNG ELECTRONICS CO LTD4 citations72
US11373980B2Jun 28, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations70
US12170249B2Dec 17, 2024
Semiconductor package including interposer
SAMSUNG ELECTRONICS CO LTD0 citations62
US11462464B2Oct 4, 2022
Fan-out semiconductor package having redistribution line structure
SAMSUNG ELECTRONICS CO LTD0 citations62
US11355440B2Jun 7, 2022
Semiconductor package including interposer
SAMSUNG ELECTRONICS CO LTD0 citations62
US11101231B2Aug 24, 2021
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12009277B2Jun 11, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11967549B2Apr 23, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11177205B2Nov 16, 2021
Semiconductor package having multi-level and multi-directional shape narrowing vias
SAMSUNG ELECTRONICS CO LTD0 citations60
US10879163B2Dec 29, 2020
Fan-out semiconductor package having redistribution line structure
SAMSUNG ELECTRONICS CO LTD0 citations51
LG INF & COMM LTD
6 patentsUS6563807B1May 13, 2003
Inter-frequency handoff execution method and apparatus in mobile communication system
LG INF & COMM LTD121 citations98
US6665281B1Dec 16, 2003
Method and system for providing inter-frequency handoff in a telephone system
LG INF & COMM LTD21 citations92
US6339590B2Jan 15, 2002
Method and system for providing inter-frequency handoff in a telephone system
LG INF & COMM LTD20 citations92
US6504816B1Jan 7, 2003
Baseband signal demodulating apparatus and method in mobile radio communication system
LG INF & COMM LTD14 citations84
US6351839B1Feb 26, 2002
State metric memory of viterbi decoder and its decoding method
LG INF & COMM LTD12 citations74
US6148009ANov 14, 2000
Timing signal supplying device of doubled timing synchronous system
LG INF & COMM LTD2 citations62