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Inventor
DHINDSA MANJIT
US
3 patents
Patents
3 patents
US7672132B2
Mar 2, 2010
Electronic packaging apparatus and method
INTEL CORP
21 citations
89
US7364063B2
Apr 29, 2008
Thermally coupling an integrated heat spreader to a heat sink base
INTEL CORP
23 citations
88
US7160758B2
Jan 9, 2007
Electronic packaging apparatus and method
INTEL CORP
7 citations
70