Inventor
SOMEKH SASSON
US73 patents
⚠️ This page may combine multiple inventors who share the name “SOMEKH SASSON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
49 patentsUS6640151B1Oct 28, 2003
Multi-tool control system, method and medium
APPLIED MATERIALS INC167 citations99
US6291334B1Sep 18, 2001
Etch stop layer for dual damascene process
APPLIED MATERIALS INC365 citations99
US6244935B1Jun 12, 2001
Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
APPLIED MATERIALS INC178 citations99
US6179709B1Jan 30, 2001
In-situ monitoring of linear substrate polishing operations
APPLIED MATERIALS INC181 citations99
US5897426AApr 27, 1999
Chemical mechanical polishing with multiple polishing pads
APPLIED MATERIALS INC179 citations99
US5849136ADec 15, 1998
High frequency semiconductor wafer processing apparatus and method
APPLIED MATERIALS INC188 citations99
US5804507ASep 8, 1998
Radially oscillating carousel processing system for chemical mechanical polishing
APPLIED MATERIALS INC243 citations99
US5745331AApr 28, 1998
Electrostatic chuck with conformal insulator film
APPLIED MATERIALS INC166 citations99
US5738574AApr 14, 1998
Continuous processing system for chemical mechanical polishing
APPLIED MATERIALS INC797 citations99
US5618382AApr 8, 1997
High-frequency semiconductor wafer processing apparatus and method
APPLIED MATERIALS INC125 citations99
US5186718AFeb 16, 1993
Staged-vacuum wafer processing system and method
APPLIED MATERIALS INC998 citations99
US4668365AMay 26, 1987
Apparatus and method for magnetron-enhanced plasma-assisted chemical vapor deposition
APPLIED MATERIALS INC229 citations99
US6258170B1Jul 10, 2001
Vaporization and deposition apparatus
APPLIED MATERIALS INC307 citations98
US5957751ASep 28, 1999
Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
APPLIED MATERIALS INC147 citations98
US5882165AMar 16, 1999
Multiple chamber integrated process system
APPLIED MATERIALS INC789 citations98
US5855681AJan 5, 1999
Ultra high throughput wafer vacuum processing system
APPLIED MATERIALS INC1,143 citations98
US5292393AMar 8, 1994
Multichamber integrated process system
APPLIED MATERIALS INC386 citations98
US5250467AOct 5, 1993
Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer
APPLIED MATERIALS INC116 citations98
US5215619AJun 1, 1993
Magnetic field-enhanced plasma etch reactor
APPLIED MATERIALS INC194 citations98
US4951601AAug 28, 1990
Multi-chamber integrated process system
APPLIED MATERIALS INC1,271 citations98
US4842683AJun 27, 1989
Magnetic field-enhanced plasma etch reactor
APPLIED MATERIALS INC410 citations98
US6110011AAug 29, 2000
Integrated electrodeposition and chemical-mechanical polishing tool
APPLIED MATERIALS INC115 citations97
US5556147ASep 17, 1996
Wafer tray and ceramic blade for semiconductor processing apparatus
APPLIED MATERIALS INC112 citations97
US7614939B2Nov 10, 2009
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
APPLIED MATERIALS INC39 citations96
US6796880B2Sep 28, 2004
Linear polishing sheet with window
APPLIED MATERIALS INC42 citations96
US6585563B1Jul 1, 2003
In-situ monitoring of linear substrate polishing operations
APPLIED MATERIALS INC35 citations96
US6435945B1Aug 20, 2002
Chemical mechanical polishing with multiple polishing pads
APPLIED MATERIALS INC38 citations96
US6427703B1Aug 6, 2002
Method and apparatus for removing carbon contamination in a sub-atmospheric charged particle beam lithography system
APPLIED MATERIALS INC63 citations96
US6394109B1May 28, 2002
Method and apparatus for removing carbon contamination in a sub-atmospheric charged particle beam lithography system
APPLIED MATERIALS INC72 citations96
US6352467B1Mar 5, 2002
Integrated electrodeposition and chemical mechanical polishing tool
APPLIED MATERIALS INC48 citations96
US6165271ADec 26, 2000
Temperature controlled process and chamber lid
APPLIED MATERIALS INC49 citations96
US6126517AOct 3, 2000
System for chemical mechanical polishing having multiple polishing stations
APPLIED MATERIALS INC63 citations96
US6093082AJul 25, 2000
Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
APPLIED MATERIALS INC31 citations96
US6080046AJun 27, 2000
Underwater wafer storage and wafer picking for chemical mechanical polishing
APPLIED MATERIALS INC49 citations96
US5753132AMay 19, 1998
Method of making electrostatic chuck with conformal insulator film
APPLIED MATERIALS INC78 citations96
US5384008AJan 24, 1995
Process and apparatus for full wafer deposition
APPLIED MATERIALS INC72 citations96
US4618262AOct 21, 1986
Laser interferometer system and method for monitoring and controlling IC processing
APPLIED MATERIALS INC209 citations96
US5636964AJun 10, 1997
Wafer tray and ceramic blade for semiconductor processing apparatus
APPLIED MATERIALS INC75 citations95
US5570994ANov 5, 1996
Wafer tray and ceramic blade for semiconductor processing apparatus
APPLIED MATERIALS INC60 citations95
US4668338AMay 26, 1987
Magnetron-enhanced plasma etching process
APPLIED MATERIALS INC120 citations95
US6763130B1Jul 13, 2004
Real time defect source identification
APPLIED MATERIALS INC69 citations94
US6023405AFeb 8, 2000
Electrostatic chuck with improved erosion resistance
APPLIED MATERIALS INC56 citations94
US5822171AOct 13, 1998
Electrostatic chuck with improved erosion resistance
APPLIED MATERIALS INC74 citations94
US7255632B2Aug 14, 2007
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
APPLIED MATERIALS INC13 citations93
US7097544B1Aug 29, 2006
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
APPLIED MATERIALS INC18 citations93
US7008303B2Mar 7, 2006
Web lift system for chemical mechanical planarization
APPLIED MATERIALS INC31 citations93
US6991517B2Jan 31, 2006
Linear polishing sheet with window
APPLIED MATERIALS INC29 citations93
US6979248B2Dec 27, 2005
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC42 citations93
US6582282B2Jun 24, 2003
Chemical mechanical polishing with multiple polishing pads
APPLIED MATERIALS INC15 citations93
HUGHES AIRCRAFT CO
1 patentShowing the top 50 of 73 patents by PatentIndex Score.