P

Inventor

PARK JUNGHO

US48 patents
⚠️ This page may combine multiple inventors who share the name “PARK JUNGHO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

24 patents
US12218407B2Feb 4, 2025

Antenna module and device including same

SAMSUNG ELECTRONICS CO LTD2 citations74
US11282995B2Mar 22, 2022

Display module package

SAMSUNG ELECTRONICS CO LTD2 citations73
US12327197B2Jun 10, 2025

System and method for providing content based on knowledge graph

SAMSUNG ELECTRONICS CO LTD2 citations72
US11264354B2Mar 1, 2022

Wafer level package

SAMSUNG ELECTRONICS CO LTD2 citations72
US11145611B2Oct 12, 2021

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD3 citations72
US11874885B2Jan 16, 2024

Method and apparatus for providing content based on knowledge graph

SAMSUNG ELECTRONICS CO LTD4 citations71
US10224607B2Mar 5, 2019

Antenna device and electronic device including same

SAMSUNG ELECTRONICS CO LTD2 citations69
US12586910B2Mar 24, 2026

Antenna structure and electronic device comprising same

SAMSUNG ELECTRONICS CO LTD0 citations62
US12418119B2Sep 16, 2025

Antenna assembly and electronic device including same

SAMSUNG ELECTRONICS CO LTD0 citations62
US12300898B2May 13, 2025

Separable antenna and electronic device comprising same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11942586B2Mar 26, 2024

Display module package

SAMSUNG ELECTRONICS CO LTD0 citations62
US11901276B2Feb 13, 2024

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US11894338B2Feb 6, 2024

Wafer level package

SAMSUNG ELECTRONICS CO LTD1 citations62
US11637081B2Apr 25, 2023

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11569157B2Jan 31, 2023

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11056461B2Jul 6, 2021

Method of manufacturing fan-out wafer level package

SAMSUNG ELECTRONICS CO LTD1 citations62
US12444831B2Oct 14, 2025

Electronic device including interposing board for antenna

SAMSUNG ELECTRONICS CO LTD0 citations60
US12316008B2May 27, 2025

Antenna device and electronic device including the same

SAMSUNG ELECTRONICS CO LTD0 citations60
US12176620B2Dec 24, 2024

Antenna device and electronic device including the same

SAMSUNG ELECTRONICS CO LTD1 citations60
US12095876B2Sep 17, 2024

Electronic apparatus and method for controlling thereof

SAMSUNG ELECTRONICS CO LTD0 citations56
US12566693B2Mar 3, 2026

Memory device storing mapping information, memory system including the same, and operating method of memory system

SAMSUNG ELECTRONICS CO LTD0 citations52
US12581006B2Mar 17, 2026

Wireless module and electronic device including the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US12541302B2Feb 3, 2026

Method of performing copyback operation in nonvolatile memory device, and nonvolatile memory device and storage device performing the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US12111864B2Oct 8, 2024

Electronic device and control method therefor

SAMSUNG ELECTRONICS CO LTD0 citations49

BOE TECHNOLOGY GROUP CO LTD

4 patents

CHONGQING BOE OPTOELECTRONICS TECH CO LTD

4 patents

PALO ALTO RES CT INC

3 patents

MOREH CORP

3 patents

TORQUE TRACTION TECHNOLOGIES L

2 patents

DANA AUTOMOTIVE SYSTEMS GROUP

2 patents

HYUNDAI MOTOR CO LTD

2 patents

SAMSUNG DISPLAY CO LTD

1 patent

MECHANICAL DYNAMICS INC

1 patent

LG DISPLAY CO LTD

1 patent

PARK JUNGHO

1 patent