Inventor
YANG JEONGHO
US2 patents
Patents
2 patentsUS11935864B2Mar 19, 2024
Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods
KULICKE & SOFFA IND INC0 citations57
US11515285B2Nov 29, 2022
Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods
KULICKE & SOFFA IND INC0 citations57