P

Inventor

MATSUMOTO KUNIO

JP59 patents
⚠️ This page may combine multiple inventors who share the name “MATSUMOTO KUNIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

17 patents
US5086337AFeb 4, 1992

Connecting structure of electronic part and electronic device using the structure

HITACHI LTD245 citations98
US4893172AJan 9, 1990

Connecting structure for electronic part and method of manufacturing the same

HITACHI LTD345 citations98
US5491301AFeb 13, 1996

Shielding method and circuit board employing the same

HITACHI LTD73 citations96
US5406027AApr 11, 1995

Mounting structure and electronic device employing the same

HITACHI LTD64 citations96
US5373112ADec 13, 1994

Multilayered wiring board having printed inductor

HITACHI LTD68 citations96
US5219765AJun 15, 1993

Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process

HITACHI LTD160 citations96
US5089104AFeb 18, 1992

Method and apparatus for forming a multiple-element thin film based on ion beam sputtering

HITACHI LTD73 citations96
US5811877ASep 22, 1998

Semiconductor device structure

HITACHI LTD84 citations95
US6566150B2May 20, 2003

Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step

HITACHI LTD15 citations92
US6455335B1Sep 24, 2002

Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step

HITACHI LTD17 citations92
US4922377AMay 1, 1990

Module and a substrate for the module

HITACHI LTD39 citations92
US6153938ANov 28, 2000

Flip-chip connecting method, flip-chip connected structure and electronic device using the same

HITACHI LTD38 citations89
US6197603B1Mar 6, 2001

Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step

HITACHI LTD12 citations82
US6554194B1Apr 29, 2003

IC card and its manufacturing method

HITACHI LTD9 citations74
US4564261AJan 14, 1986

Bundle of optical fibers

HITACHI LTD14 citations72
US7198962B2Apr 3, 2007

Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step

HITACHI LTD3 citations62
US6635971B2Oct 21, 2003

Electronic device and optical transmission module

HITACHI LTD6 citations60

TOYO JOZO KK

8 patents

COPAL CO LTD

7 patents

PIONEER ELECTRONIC CORP

5 patents

KRINGLE PHARMA INC

3 patents

SONY CORP

2 patents

HITACHI MEDIA ELECTRON KK

2 patents

NEC CORP

1 patent

TOYO BOSEKI

1 patent

NAKAMURA TOSHIKAZU

1 patent

MITSUBISHI ELECTRIC CORP

1 patent

TOMITA KATSURO

1 patent

PIONEER CORP

1 patent

Showing the top 50 of 59 patents by PatentIndex Score.