P

Inventor

HWANG DAVID K

US31 patents
⚠️ This page may combine multiple inventors who share the name “HWANG DAVID K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

25 patents
US7696568B2Apr 13, 2010

Semiconductor device having reduced sub-threshold leakage

MICRON TECHNOLOGY INC18 citations92
US7687342B2Mar 30, 2010

Method of manufacturing a memory device

MICRON TECHNOLOGY INC22 citations92
US7271106B2Sep 18, 2007

Critical dimension control for integrated circuits

MICRON TECHNOLOGY INC17 citations92
US7563723B2Jul 21, 2009

Critical dimension control for integrated circuits

MICRON TECHNOLOGY INC11 citations83
US7897465B2Mar 1, 2011

Semiconductor device having reduced sub-threshold leakage

MICRON TECHNOLOGY INC6 citations73
US7648915B2Jan 19, 2010

Methods of forming semiconductor constructions, and methods of recessing materials within openings

MICRON TECHNOLOGY INC5 citations73
US7601591B2Oct 13, 2009

Method of manufacturing sidewall spacers on a memory device, and device comprising same

MICRON TECHNOLOGY INC5 citations73
US7341906B2Mar 11, 2008

Method of manufacturing sidewall spacers on a memory device, and device comprising same

MICRON TECHNOLOGY INC6 citations73
US7935999B2May 3, 2011

Memory device

MICRON TECHNOLOGY INC2 citations63
US11670707B2Jun 6, 2023

Integrated assemblies and methods of forming integrated assemblies

MICRON TECHNOLOGY INC0 citations62
US11393920B2Jul 19, 2022

Integrated assemblies and methods of forming integrated assemblies

MICRON TECHNOLOGY INC0 citations62
US8030168B2Oct 4, 2011

Methods of forming DRAM memory cells

MICRON TECHNOLOGY INC4 citations62
US8022473B2Sep 20, 2011

Semiconductor device having reduced sub-threshold leakage

MICRON TECHNOLOGY INC3 citations62
US7459742B2Dec 2, 2008

Method of manufacturing sidewall spacers on a memory device, and device comprising same

MICRON TECHNOLOGY INC4 citations62
US12526976B2Jan 13, 2026

Vertical digit lines with alternating epitaxial silicon for horizontal access devices in 3D memory

MICRON TECHNOLOGY INC0 citations60
US12526974B2Jan 13, 2026

Multiple, alternating epitaxial silicon for horizontal access devices in vertical three dimensional (3D) memory

MICRON TECHNOLOGY INC0 citations60
US11889680B2Jan 30, 2024

Integrated assemblies and methods of forming integrated assemblies

MICRON TECHNOLOGY INC0 citations52
US11777036B2Oct 3, 2023

Integrated assemblies and methods of forming integrated assemblies

MICRON TECHNOLOGY INC0 citations52
US10643906B2May 5, 2020

Methods of forming a transistor and methods of forming an array of memory cells

MICRON TECHNOLOGY INC0 citations52
US7329910B2Feb 12, 2008

Semiconductor substrates and field effect transistor constructions

MICRON TECHNOLOGY INC1 citations52
US7081416B2Jul 25, 2006

Methods of forming field effect transistor gates

MICRON TECHNOLOGY INC0 citations52
US7948030B2May 24, 2011

Semiconductor constructions of memory devices with different sizes of GateLine trenches

MICRON TECHNOLOGY INC0 citations51
US7808041B2Oct 5, 2010

Semiconductor constructions of memory device with different depth gate line trenches

MICRON TECHNOLOGY INC0 citations51
US12568615B2Mar 3, 2026

Support pillars with multiple, alternating epitaxial silicon for horizontal access devices in vertical three-dimensional (3D) memory

MICRON TECHNOLOGY INC0 citations50
US12557266B2Feb 17, 2026

Fabrication method of a lateral 3D memory device

MICRON TECHNOLOGY INC0 citations50

EMHART GLASS MACH INVEST

1 patent

HWANG DAVID K

1 patent

EMHART GLASS SA

1 patent

EMHART INC

1 patent

BUSCH BRETT W

1 patent

LINDHOLM LARSON D

1 patent