Inventor
HWANG DAVID K
US31 patents
⚠️ This page may combine multiple inventors who share the name “HWANG DAVID K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
25 patentsUS7696568B2Apr 13, 2010
Semiconductor device having reduced sub-threshold leakage
MICRON TECHNOLOGY INC18 citations92
US7687342B2Mar 30, 2010
Method of manufacturing a memory device
MICRON TECHNOLOGY INC22 citations92
US7271106B2Sep 18, 2007
Critical dimension control for integrated circuits
MICRON TECHNOLOGY INC17 citations92
US7563723B2Jul 21, 2009
Critical dimension control for integrated circuits
MICRON TECHNOLOGY INC11 citations83
US7897465B2Mar 1, 2011
Semiconductor device having reduced sub-threshold leakage
MICRON TECHNOLOGY INC6 citations73
US7648915B2Jan 19, 2010
Methods of forming semiconductor constructions, and methods of recessing materials within openings
MICRON TECHNOLOGY INC5 citations73
US7601591B2Oct 13, 2009
Method of manufacturing sidewall spacers on a memory device, and device comprising same
MICRON TECHNOLOGY INC5 citations73
US7341906B2Mar 11, 2008
Method of manufacturing sidewall spacers on a memory device, and device comprising same
MICRON TECHNOLOGY INC6 citations73
US7935999B2May 3, 2011
Memory device
MICRON TECHNOLOGY INC2 citations63
US11670707B2Jun 6, 2023
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11393920B2Jul 19, 2022
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US8030168B2Oct 4, 2011
Methods of forming DRAM memory cells
MICRON TECHNOLOGY INC4 citations62
US8022473B2Sep 20, 2011
Semiconductor device having reduced sub-threshold leakage
MICRON TECHNOLOGY INC3 citations62
US7459742B2Dec 2, 2008
Method of manufacturing sidewall spacers on a memory device, and device comprising same
MICRON TECHNOLOGY INC4 citations62
US12526976B2Jan 13, 2026
Vertical digit lines with alternating epitaxial silicon for horizontal access devices in 3D memory
MICRON TECHNOLOGY INC0 citations60
US12526974B2Jan 13, 2026
Multiple, alternating epitaxial silicon for horizontal access devices in vertical three dimensional (3D) memory
MICRON TECHNOLOGY INC0 citations60
US11889680B2Jan 30, 2024
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations52
US11777036B2Oct 3, 2023
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations52
US10643906B2May 5, 2020
Methods of forming a transistor and methods of forming an array of memory cells
MICRON TECHNOLOGY INC0 citations52
US7329910B2Feb 12, 2008
Semiconductor substrates and field effect transistor constructions
MICRON TECHNOLOGY INC1 citations52
US7081416B2Jul 25, 2006
Methods of forming field effect transistor gates
MICRON TECHNOLOGY INC0 citations52
US7948030B2May 24, 2011
Semiconductor constructions of memory devices with different sizes of GateLine trenches
MICRON TECHNOLOGY INC0 citations51
US7808041B2Oct 5, 2010
Semiconductor constructions of memory device with different depth gate line trenches
MICRON TECHNOLOGY INC0 citations51
US12568615B2Mar 3, 2026
Support pillars with multiple, alternating epitaxial silicon for horizontal access devices in vertical three-dimensional (3D) memory
MICRON TECHNOLOGY INC0 citations50
US12557266B2Feb 17, 2026
Fabrication method of a lateral 3D memory device
MICRON TECHNOLOGY INC0 citations50