Inventor

VERBUNT HAN

NL2 patents

Patents

2 patents

US6897152B2May 24, 2005

Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication

ENTHONE17 citations75

US6875260B2Apr 5, 2005

Copper activator solution and method for semiconductor seed layer enhancement

ENTHONE3 citations54