Inventor · disambiguated record
Steven P. Ostrander
Also filed as: OSTRANDER STEVEN · OSTRANDER STEVEN P · OSTRANDER STEVEN PAUL
43 granted patents·9 pending applications·523 citations·filing 1993–2024
98Inventor score
Top patents by PatentIndex Score
52 records- 0196US7816785B2Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and packageIBM·Filed 2009·Granted Oct 19, 2010·45 cites·10 claims
- 0293US9366591B2Determining magnitude of compressive loadingIBM·Filed 2014·Granted Jun 14, 2016·10 cites·12 claims
- 0391US6502999B1Opto-electronic transceiver module and hermetically sealed housing thereforeJDS UNIPHASE CORP·Filed 2001·Granted Jan 7, 2003·55 cites·18 claims
- 0490US11308257B1Stacked via rivets in chip hotspotsIBM·Filed 2020·Granted Apr 19, 2022·2 cites·17 claims
- 0587US7462294B2Enhanced thermal conducting formulationsIBM·Filed 2007·Granted Dec 9, 2008·13 cites·3 claims
- 0687US7079393B2Fluidic cooling systems and methods for electronic componentsIBM·Filed 2004·Granted Jul 18, 2006·44 cites·21 claims
- 0786US11228124B1Connecting a component to a substrate by adhesion to an oxidized solder surfaceIBM·Filed 2021·Granted Jan 18, 2022·1 cites·14 claims
- 0884US6821026B2Redundant configurable VCSEL laser array optical light sourceIBM·Filed 2002·Granted Nov 23, 2004·21 cites·17 claims
- 0983US9601423B1Under die surface mounted electrical elementsIBM·Filed 2015·Granted Mar 21, 2017·4 cites·15 claims
- 1082US9947598B1Determining crackstop strength of integrated circuit assembly at the wafer levelIBM·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
- 1181US8794079B2Determining magnitude of compressive loadingBODENWEBER PAUL F·Filed 2011·Granted Aug 5, 2014·3 cites·9 claims
- 1279US9048245B2Method for shaping a laminate substrateBLACKSHEAR EDMUND·Filed 2012·Granted Jun 2, 2015·5 cites·20 claims
- 1379US8363404B2Implementing loading and heat removal for hub module assemblyIBM·Filed 2010·Granted Jan 29, 2013·5 cites·20 claims
- 1479US5813870ASelectively filled adhesives for semiconductor chip interconnection and encapsulationIBM·Filed 1996·Granted Sep 29, 1998·55 cites·22 claims
- 1579US5468427AProcess for making ultra-fine ceramic particlesUNIV ALFRED RES·Filed 1993·Granted Nov 21, 1995·33 cites·17 claims
- 1678US8492199B2Reworkable underfills for ceramic MCM C4 protectionCOFFIN JEFFREY T·Filed 2011·Granted Jul 23, 2013·6 cites·20 claims
- 1774US9272498B2Precast thermal interface adhesive for easy and repeated, separation and rematingCOLGAN EVAN GEORGE·Filed 2012·Granted Mar 1, 2016·2 cites·13 claims
- 1871US10325830B1Multipart lid for a semiconductor package with multiple componentsIBM·Filed 2017·Granted Jun 18, 2019·1 cites·17 claims
- 1970US9059240B2Fixture for shaping a laminate substrateBLACKSHEAR EDMUND D·Filed 2012·Granted Jun 16, 2015·3 cites·25 claims
- 2069US5866044ALead free conductive composites for electrical interconnectionsIBM·Filed 1996·Granted Feb 2, 1999·32 cites·4 claims
- 2167US5660774AProcess for making a sintered body from ultra-fine superconductive particlesUNIV ALFRED RES·Filed 1995·Granted Aug 26, 1997·30 cites·5 claims
- 2266US6819813B2Optical land grid array interposerIBM·Filed 2002·Granted Nov 16, 2004·10 cites·20 claims
- 2364US9543253B2Method for shaping a laminate substrateGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 10, 2017·1 cites·20 claims
- 2464US8900927B2Multichip electronic packages and methods of manufactureBEAUMIER MARTIN M·Filed 2010·Granted Dec 2, 2014·2 cites·22 claims
- 2564US5716565AProcess for making ultra-fine stabilized zirconia particlesUNIV ALFRED RES·Filed 1995·Granted Feb 10, 1998·28 cites·7 claims
- 2664US5545429AFabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocessIBM·Filed 1994·Granted Aug 13, 1996·25 cites·47 claims
- 2762US2025349798A1Multiple chip module with integrated microchannel coolingIBM·Filed 2024·Application pending·0 cites
- 2862US2025391811A1Utilizing formate shells for metal structures on integrated circuit componentsIBM·Filed 2024·Application pending·0 cites
- 2962US2025349580A1Verifying alignment of multiple die on a substrateIBM·Filed 2024·Application pending·0 cites
- 3061US12504747B2Multicomponent module design and fabricationIBM·Filed 2021·Granted Dec 23, 2025·0 cites·19 claims
- 3161US8085550B2Implementing enhanced solder joint robustness for SMT pad structureHOFFMEYER MARK KENNETH·Filed 2009·Granted Dec 27, 2011·2 cites·20 claims
- 3261US6197222B1Lead free conductive composites for electrical interconnectionsIBM·Filed 1998·Granted Mar 6, 2001·22 cites·4 claims
- 3358US10777482B2Multipart lid for a semiconductor package with multiple componentsELPIS TECH INC·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 3458US7786579B2Apparatus for crack prevention in integrated circuit packagesIBM·Filed 2007·Granted Aug 31, 2010·1 cites·4 claims
- 3558US2025098062A1Tamper-detect assemblies including heat sink covers with integrated tamper-detect circuitryIBM·Filed 2023·Application pending·0 cites
- 3657US5660772AProcess for making ultra-fine barium hexaferrite particlesUNIV ALFRED RES·Filed 1995·Granted Aug 26, 1997·14 cites·12 claims
- 3756US11882645B2Multi chip hardware security moduleIBM·Filed 2021·Granted Jan 23, 2024·0 cites·18 claims
- 3856US2024213217A1Clustering fine pitch micro-bumps for packaging and testIBM·Filed 2022·Application pending·0 cites
- 3955US11239183B2Mitigating thermal-mechanical strain and warpage of an organic laminate substrateIBM·Filed 2020·Granted Feb 1, 2022·0 cites·18 claims
- 4055US9219051B2Laminate peripheral clamping to control microelectronic module BSM warpageIBM·Filed 2013·Granted Dec 22, 2015·1 cites·12 claims
- 4153US11211262B2Electronic apparatus having inter-chip stiffenerIBM·Filed 2020·Granted Dec 28, 2021·0 cites·19 claims
- 4253US5660773AProcess for making ultra-fine yttrium-iron-garnet particlesUNIV ALFRED RES·Filed 1995·Granted Aug 26, 1997·15 cites·11 claims
- 4353US5523065AProcess for making ultra-fine barium titanate particlesUNIV ALFRED RES·Filed 1995·Granted Jun 4, 1996·23 cites·14 claims
- 4450US6827505B2Optoelectronic package structure and process for planar passive optical and optoelectronic devicesIBM·Filed 2002·Granted Dec 7, 2004·4 cites·20 claims
- 4547US8906809B2Multichip electronic packages and methods of manufactureBEAUMIER MARTIN M·Filed 2012·Granted Dec 9, 2014·0 cites·19 claims
- 4647US8268389B2Precast thermal interface adhesive for easy and repeated, separation and rematingCOLGAN EVAN G·Filed 2010·Granted Sep 18, 2012·0 cites·11 claims
- 4747US6836015B2Optical assemblies for transmitting and manipulating optical beamsIBM·Filed 2003·Granted Dec 28, 2004·1 cites·20 claims
- 4847US2021233824A1Chip corner guard for chip-package interaction failure mitigationIBM·Filed 2020·Application pending·0 cites
- 4947US2007290378A1Novel reworkable underfills for ceramic mcm c4 protectionIBM·Filed 2006·Application pending·0 cites
- 5046US6908025B2Preparing MCM hat for removalIBM·Filed 2003·Granted Jun 21, 2005·1 cites·20 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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