Inventor
CHEN CHEE KOANG
MY3 patents
Patents
3 patentsUS7332823B2Feb 19, 2008
Providing a metal layer in a semiconductor package
INTEL CORP14 citations77
US7678616B2Mar 16, 2010
Thermal management method including a metallic layer directly on an integrated heat spreader and integrated circuit
INTEL CORP5 citations70
US7439618B2Oct 21, 2008
Integrated circuit thermal management method and apparatus
INTEL CORP3 citations59