Inventor

DEGANI YINON

US57 patents

⚠️ This page may combine multiple inventors who share the name “DEGANI YINON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DEGANI YINON

LUCENT TECHNOLOGIES INC

Solder bonding printed circuit boards

RF IC package

Thin packaging of multi-chip modules with enhanced thermal/power management

Stacked module package

Interposer for recessed flip-chip package

Flip chip bump bonding

Recessed flip-chip package

Packaging multi-chip modules without wire-bond interconnection

Solder bonding printed circuit boards

Flip chip packaging of memory chips

Flip chip metallization

Method and apparatus for assembling multichip modules

Flip chip metallization

Integrated circuit bonding method and apparatus

Method for testing integrated circuits

Method of testing and constructing monolithic multi-chip modules

Manufacture of printed circuit cards

Translator for recessed flip-chip package

Method for assembling multichip modules

Flip chip metallization

Manufacture of flip-chip device

Cleaning solder-bonded flip-chip assemblies

Apparatus and methods for interconnecting arrays of optical transmission paths employing externally located connector pads

AT & T BELL LAB

Surface mount solder assembly of leadless integrated circuit packages to substrates

Method of soldering including removal of flux residue

Optical fiber connector

Movable fiber optical switch

Solder paste

Solder paste and method of using the same

Process for improving photostability of titanium dioxide pigments in binder compositions without decreasing reflectivity

Article for connecting optical fibers

AGERE SYST GUARDIAN CORP

Multi-chip ball grid array IC packages

Packaging micromechanical devices

Interconnecting micromechanical devices

Testing integrated circuits

Packaging silicon on silicon multichip modules

Low cost ball grid array package

AT & T CORP

Electronic device package having electronic device boonded, at a localized region thereof, to circuit board

Process for fabircating an integrated circuit

Solder paste mixture

Soldering material and procedure

Method for bumping silicon devices

SYCHIP INC

Integrated passive devices

Integrated passive devices

Integrated passive devices with high Q inductors

Compact balun transformers

SDIO memory and interface card

AGERE SYSTEMS INC

High performance multi-chip IC package

Low profile integrated circuit packages

DEGANI YINON

RF devices