Inventor
DUDDERAR THOMAS DIXON
US22 patents
⚠️ This page may combine multiple inventors who share the name “DUDDERAR THOMAS DIXON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LUCENT TECHNOLOGIES INC
13 patentsUS5646828AJul 8, 1997
Thin packaging of multi-chip modules with enhanced thermal/power management
LUCENT TECHNOLOGIES INC359 citations99
US6734539B2May 11, 2004
Stacked module package
LUCENT TECHNOLOGIES INC227 citations98
US6175158B1Jan 16, 2001
Interposer for recessed flip-chip package
LUCENT TECHNOLOGIES INC115 citations98
US5990564ANov 23, 1999
Flip chip packaging of memory chips
LUCENT TECHNOLOGIES INC61 citations96
US5966903AOct 19, 1999
High speed flip-chip dispensing
LUCENT TECHNOLOGIES INC65 citations96
US5767447AJun 16, 1998
Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
LUCENT TECHNOLOGIES INC67 citations96
US6680212B2Jan 20, 2004
Method of testing and constructing monolithic multi-chip modules
LUCENT TECHNOLOGIES INC24 citations92
US6370766B1Apr 16, 2002
Manufacture of printed circuit cards
LUCENT TECHNOLOGIES INC30 citations92
US6205745B1Mar 27, 2001
High speed flip-chip dispensing
LUCENT TECHNOLOGIES INC39 citations92
US6160715ADec 12, 2000
Translator for recessed flip-chip package
LUCENT TECHNOLOGIES INC39 citations92
US6077725AJun 20, 2000
Method for assembling multichip modules
LUCENT TECHNOLOGIES INC42 citations92
US6020219AFeb 1, 2000
Method of packaging fragile devices with a gel medium confined by a rim member
LUCENT TECHNOLOGIES INC47 citations92
US5778913AJul 14, 1998
Cleaning solder-bonded flip-chip assemblies
LUCENT TECHNOLOGIES INC13 citations73
AGERE SYST GUARDIAN CORP
6 patentsUS6437990B1Aug 20, 2002
Multi-chip ball grid array IC packages
AGERE SYST GUARDIAN CORP110 citations98
US6433411B1Aug 13, 2002
Packaging micromechanical devices
AGERE SYST GUARDIAN CORP113 citations98
US6396711B1May 28, 2002
Interconnecting micromechanical devices
AGERE SYST GUARDIAN CORP115 citations98
US6297551B1Oct 2, 2001
Integrated circuit packages with improved EMI characteristics
AGERE SYST GUARDIAN CORP210 citations98
US6369444B1Apr 9, 2002
Packaging silicon on silicon multichip modules
AGERE SYST GUARDIAN CORP47 citations92
US6282100B1Aug 28, 2001
Low cost ball grid array package
AGERE SYST GUARDIAN CORP9 citations74