Inventor
TAI KING LIEN
US29 patents
⚠️ This page may combine multiple inventors who share the name “TAI KING LIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LUCENT TECHNOLOGIES INC
15 patentsUS6013877AJan 11, 2000
Solder bonding printed circuit boards
LUCENT TECHNOLOGIES INC124 citations99
US5869894AFeb 9, 1999
RF IC package
LUCENT TECHNOLOGIES INC180 citations99
US6175158B1Jan 16, 2001
Interposer for recessed flip-chip package
LUCENT TECHNOLOGIES INC115 citations98
US6100475AAug 8, 2000
Solder bonding printed circuit boards
LUCENT TECHNOLOGIES INC51 citations96
US5990564ANov 23, 1999
Flip chip packaging of memory chips
LUCENT TECHNOLOGIES INC61 citations96
US6075427AJun 13, 2000
MCM with high Q overlapping resonator
LUCENT TECHNOLOGIES INC70 citations95
US6075691AJun 13, 2000
Thin film capacitors and process for making them
LUCENT TECHNOLOGIES INC110 citations94
US5936831AAug 10, 1999
Thin film tantalum oxide capacitors and resulting product
LUCENT TECHNOLOGIES INC57 citations94
US5747982AMay 5, 1998
Multi-chip modules with isolated coupling between modules
LUCENT TECHNOLOGIES INC79 citations94
US6680212B2Jan 20, 2004
Method of testing and constructing monolithic multi-chip modules
LUCENT TECHNOLOGIES INC24 citations92
US6160715ADec 12, 2000
Translator for recessed flip-chip package
LUCENT TECHNOLOGIES INC39 citations92
US6077725AJun 20, 2000
Method for assembling multichip modules
LUCENT TECHNOLOGIES INC42 citations92
US5699105ADec 16, 1997
Curbside circuitry for interactive communication services
LUCENT TECHNOLOGIES INC40 citations91
US6029224AFeb 22, 2000
Self-contained memory apparatus having diverse types of memory and distributed control
LUCENT TECHNOLOGIES INC43 citations90
US5834160ANov 10, 1998
Method and apparatus for forming fine patterns on printed circuit board
LUCENT TECHNOLOGIES INC44 citations87
AGERE SYST GUARDIAN CORP
6 patentsUS6437990B1Aug 20, 2002
Multi-chip ball grid array IC packages
AGERE SYST GUARDIAN CORP110 citations98
US6433411B1Aug 13, 2002
Packaging micromechanical devices
AGERE SYST GUARDIAN CORP113 citations98
US6396711B1May 28, 2002
Interconnecting micromechanical devices
AGERE SYST GUARDIAN CORP115 citations98
US6465336B2Oct 15, 2002
Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module
AGERE SYST GUARDIAN CORP29 citations93
US6281590B1Aug 28, 2001
Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module
AGERE SYST GUARDIAN CORP31 citations93
US6369444B1Apr 9, 2002
Packaging silicon on silicon multichip modules
AGERE SYST GUARDIAN CORP47 citations92
AGERE SYSTEMS INC
5 patentsUS6678167B1Jan 13, 2004
High performance multi-chip IC package
AGERE SYSTEMS INC109 citations98
US6683384B1Jan 27, 2004
Air isolated crossovers
AGERE SYSTEMS INC20 citations92
US6251705B1Jun 26, 2001
Low profile integrated circuit packages
AGERE SYSTEMS INC27 citations92
US6560735B1May 6, 2003
Methods and apparatus for testing integrated circuits
AGERE SYSTEMS INC0 citations47
US6232047B1May 15, 2001
Fabricating high-Q RF components
AGERE SYSTEMS INC0 citations41