Inventor
HAYAKAWA MASAO
JP16 patents
⚠️ This page may combine multiple inventors who share the name “HAYAKAWA MASAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHARP KK
9 patentsUS5310699AMay 10, 1994
Method of manufacturing a bump electrode
SHARP KK110 citations97
US4300153ANov 10, 1981
Flat shaped semiconductor encapsulation
SHARP KK151 citations96
US4151543AApr 24, 1979
Lead electrode structure for a semiconductor chip carried on a flexible carrier
SHARP KK53 citations95
US4383363AMay 17, 1983
Method of making a through-hole connector
SHARP KK135 citations92
US4280132AJul 21, 1981
Multi-lead frame member with means for limiting mold spread
SHARP KK32 citations91
US4926239AMay 15, 1990
Plastic encapsulant for semiconductor
SHARP KK20 citations82
US4120041AOct 10, 1978
Semiconductor device for use in an electronic apparatus having a plurality of circuit boards
SHARP KK9 citations74
US4536786AAug 20, 1985
Lead electrode connection in a semiconductor device
SHARP KK8 citations72
US4247590AJan 27, 1981
Ceramic plate for supporting a semiconductor wafer
SHARP KK14 citations71
KANAI TAKAHIKO
3 patentsUS10189112B2Jan 29, 2019
Welding equipment for metallic materials and method for welding metallic materials
KANAI TAKAHIKO0 citations46
US9498840B2Nov 22, 2016
Welding structural part and welding method of the same
KANAI TAKAHIKO0 citations46
US9079266B2Jul 14, 2015
Welding equipment for metallic materials and method for welding metallic materials
KANAI TAKAHIKO1 citations46