Inventor

WAN MING YEUNG LUKE

HK4 patents

⚠️ This page may combine multiple inventors who share the name “WAN MING YEUNG LUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ASM ASSEMBLY AUTOMATION LTD

2 patents

US6616031B2Sep 9, 2003

Apparatus and method for bond force control

ASM ASSEMBLY AUTOMATION LTD47 citations86

US7727800B2Jun 1, 2010

High precision die bonding apparatus

ASM ASSEMBLY AUTOMATION LTD9 citations81

WAN MING YEUNG LUKE

1 patent

US10199350B2Feb 5, 2019

Apparatus for heating a substrate during die bonding

WAN MING YEUNG LUKE2 citations56

ASMPT SINGAPORE PTE LTD

1 patent

US11552031B2Jan 10, 2023

High precision bonding apparatus comprising heater

ASMPT SINGAPORE PTE LTD0 citations51