Inventor
KAZUI SHINICHI
JP34 patents
⚠️ This page may combine multiple inventors who share the name “KAZUI SHINICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
30 patentsUS5968382AOct 19, 1999
Laser cleavage cutting method and system
HITACHI LTD183 citations98
US6137687AOct 24, 2000
Printed circuit board, IC card, and manufacturing method thereof
HITACHI LTD66 citations96
US5832595ANov 10, 1998
Method of modifying conductive lines of an electronic circuit board and its apparatus
HITACHI LTD58 citations95
US5801350ASep 1, 1998
Surface reformation method of high polymer material
HITACHI LTD39 citations95
US5150274ASep 22, 1992
Multi-chip-module
HITACHI LTD102 citations95
US6069701AMay 30, 2000
Method and apparatus for measuring the height of an object
HITACHI LTD29 citations93
US4659587AApr 21, 1987
Electroless plating process and process for producing multilayer wiring board
HITACHI LTD65 citations93
US5551148ASep 3, 1996
Method for forming conductive bumps
HITACHI LTD27 citations92
US5499668AMar 19, 1996
Process for making electronic device
HITACHI LTD43 citations92
US4766009AAug 23, 1988
Selective working method
HITACHI LTD43 citations91
US6406357B1Jun 18, 2002
Grinding method, semiconductor device and method of manufacturing semiconductor device
HITACHI LTD19 citations90
US6498319B1Dec 24, 2002
Method and an apparatus for manufacturing multi-layer boards using laser light
HITACHI LTD27 citations89
US5940728AAug 17, 1999
Process for manufacturing electronic circuits
HITACHI LTD15 citations82
US5906309AMay 25, 1999
Solder bump measuring method and apparatus
HITACHI LTD15 citations82
US4620663ANov 4, 1986
Parts-connecting apparatus using solder
HITACHI LTD20 citations81
US6340109B2Jan 22, 2002
Solder bump measuring method and apparatus
HITACHI LTD5 citations74
US5023407AJun 11, 1991
Printed circuit board with a uniform conductive layer formed by equalization of metals therein
HITACHI LTD6 citations74
US6269998B1Aug 7, 2001
Process for manufacturing electronic circuits
HITACHI LTD9 citations73
US6161748ADec 19, 2000
Process for manufacturing electronic circuits
HITACHI LTD6 citations73
US6133135AOct 17, 2000
Process for manufacturing electronic circuits
HITACHI LTD5 citations73
US6203655B1Mar 20, 2001
Thin electronic circuit component and method and apparatus for producing the same
HITACHI LTD11 citations72
US5390446AFeb 21, 1995
Grinding method and grinding machine
HITACHI LTD19 citations71
US6677553B2Jan 13, 2004
Laser processing apparatus
HITACHI LTD9 citations70
US6196441B1Mar 6, 2001
Solder bump measuring method and apparatus
HITACHI LTD3 citations63
US5520733AMay 28, 1996
Deposition apparatus and profile-following device suitable for apparatuses such as those for deposition
HITACHI LTD5 citations63
US6423405B1Jul 23, 2002
Surface reformation method of high polymer material
HITACHI LTD2 citations62
US6410881B2Jun 25, 2002
Process for manufacturing electronic circuits
HITACHI LTD1 citations62
US6017424AJan 25, 2000
Laser assisted surface reformation method of high polymer material
HITACHI LTD1 citations62
US6551449B2Apr 22, 2003
Thin electronic circuit component and method and apparatus for producing the same
HITACHI LTD2 citations61
US5498109AMar 12, 1996
Drilling apparatus of hard brittle material and method thereof
HITACHI LTD5 citations61
HITACHI METALS LTD
3 patentsUS9978497B2May 22, 2018
Wound magnetic core and method of producing the same
HITACHI METALS LTD6 citations72
US7614541B2Nov 10, 2009
Method and apparatus for placing conductive balls
HITACHI METALS LTD2 citations59
US7431792B2Oct 7, 2008
Method and apparatus for placing conductive balls
HITACHI METALS LTD2 citations59