Inventor
CHAPMAN PHILLIP F
US12 patents
⚠️ This page may combine multiple inventors who share the name “CHAPMAN PHILLIP F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS10170476B2Jan 1, 2019
Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry
IBM5 citations84
US9842838B2Dec 12, 2017
Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry
IBM3 citations84
US8017471B2Sep 13, 2011
Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry
IBM7 citations84
US7549135B2Jun 16, 2009
Design methodology of guard ring design resistance optimization for latchup prevention
IBM13 citations84
US10978452B2Apr 13, 2021
Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry
IBM0 citations62
US9397010B2Jul 19, 2016
Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry
IBM2 citations62
US9275997B2Mar 1, 2016
Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry
IBM1 citations62
US8853789B2Oct 7, 2014
Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry
IBM1 citations62
US8987067B2Mar 24, 2015
Segmented guard ring structures with electrically insulated gap structures and design structures thereof
IBM3 citations61
US6391661B2May 21, 2002
Semiconductor and method of fabricating
IBM1 citations47
US6229155B1May 8, 2001
Semiconductor and method of fabricating
IBM1 citations47