P

Inventor

CRONIN JOHN E

US113 patents
⚠️ This page may combine multiple inventors who share the name “CRONIN JOHN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

43 patents
US5903059AMay 11, 1999

Microconnectors

IBM126 citations99
US5795830AAug 18, 1998

Reducing pitch with continuously adjustable line and space dimensions

IBM321 citations99
US5567654AOct 22, 1996

Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging

IBM150 citations99
US5466634ANov 14, 1995

Electronic modules with interconnected surface metallization layers and fabrication methods therefore

IBM153 citations99
US5326430AJul 5, 1994

Cooling microfan arrangements and process

IBM174 citations99
US6279815B1Aug 28, 2001

Stacked chip process carrier

IBM254 citations98
US5399516AMar 21, 1995

Method of making shadow RAM cell having a shallow trench EEPROM

IBM185 citations98
US4962058AOct 9, 1990

Process for fabricating multi-level integrated circuit wiring structure from a single metal deposit

IBM215 citations98
US5913713AJun 22, 1999

CMP polishing pad backside modifications for advantageous polishing results

IBM95 citations97
US5872025AFeb 16, 1999

Method for stacked three dimensional device manufacture

IBM107 citations97
US5308438AMay 3, 1994

Endpoint detection apparatus and method for chemical/mechanical polishing

IBM197 citations97
US5196722AMar 23, 1993

Shadow ram cell having a shallow trench eeprom

IBM128 citations97
US5126006AJun 30, 1992

Plural level chip masking

IBM133 citations97
US4789648ADec 6, 1988

Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias

IBM526 citations97
US5532519AJul 2, 1996

Cube wireability enhancement with chip-to-chip alignment and thickness control

IBM70 citations96
US5517057AMay 14, 1996

Electronic modules with interconnected surface metallization layers

IBM87 citations96
US5453639ASep 26, 1995

Planarized semiconductor structure using subminimum features

IBM54 citations96
US5312777AMay 17, 1994

Fabrication methods for bidirectional field emission devices and storage structures

IBM64 citations96
US5308439AMay 3, 1994

Laternal field emmission devices and methods of fabrication

IBM56 citations96
US5296775AMar 22, 1994

Cooling microfan arrangements and process

IBM66 citations96
US5292689AMar 8, 1994

Method for planarizing semiconductor structure using subminimum features

IBM82 citations96
US5233263AAug 3, 1993

Lateral field emission devices

IBM69 citations96
US5194928AMar 16, 1993

Passivation of metal in metal/polyimide structure

IBM99 citations96
US5091289AFeb 25, 1992

Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions

IBM56 citations96
US4919750AApr 24, 1990

Etching metal films with complexing chloride plasma

IBM132 citations96
US4776087AOct 11, 1988

VLSI coaxial wiring structure

IBM96 citations96
US4755478AJul 5, 1988

Method of forming metal-strapped polysilicon gate electrode for FET device

IBM106 citations96
US5466636ANov 14, 1995

Method of forming borderless contacts using a removable mandrel

IBM63 citations95
US6143640ANov 7, 2000

Method of fabricating a stacked via in copper/polyimide beol

IBM55 citations93
US6137129AOct 24, 2000

High performance direct coupled FET memory cell

IBM27 citations93
US5602051AFeb 11, 1997

Method of making stacked electrical device having regions of electrical isolation and electrical connection on a given stack level

IBM30 citations93
US5539240AJul 23, 1996

Planarized semiconductor structure with subminimum features

IBM20 citations93
US5539255AJul 23, 1996

Semiconductor structure having self-aligned interconnection metallization formed from a single layer of metal

IBM35 citations93
US5496771AMar 5, 1996

Method of making overpass mask/insulator for local interconnects

IBM53 citations93
US5189506AFeb 23, 1993

Triple self-aligned metallurgy for semiconductor devices

IBM45 citations93
US4758306AJul 19, 1988

Stud formation method optimizing insulator gap-fill and metal hole-fill

IBM28 citations93
US6246583B1Jun 12, 2001

Method and apparatus for removing heat from a semiconductor device

IBM39 citations92
US6037661AMar 14, 2000

Multichip module

IBM21 citations92
US5567653AOct 22, 1996

Process for aligning etch masks on an integrated circuit surface using electromagnetic energy

IBM31 citations92
US5549511AAug 27, 1996

Variable travel carrier device and method for planarizing semiconductor wafers

IBM31 citations92
US5334467AAug 2, 1994

Gray level mask

IBM27 citations92
US5229257AJul 20, 1993

Process for forming multi-level coplanar conductor/insulator films employing photosensitive polymide polymer compositions

IBM22 citations92
US5213916AMay 25, 1993

Method of making a gray level mask

IBM45 citations92

PROSPORTS TECH LLC

3 patents

E INK CORP

1 patent

ARMSTRONG WORLD IND INC

1 patent

GRANDIOS TECHNOLOGIES LLC

1 patent

PROSPORTS TECHNOLOGIES LLC

1 patent

Showing the top 50 of 113 patents by PatentIndex Score.