Inventor
CRONIN JOHN E
US113 patents
⚠️ This page may combine multiple inventors who share the name “CRONIN JOHN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
43 patentsUS5903059AMay 11, 1999
Microconnectors
IBM126 citations99
US5795830AAug 18, 1998
Reducing pitch with continuously adjustable line and space dimensions
IBM321 citations99
US5567654AOct 22, 1996
Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
IBM150 citations99
US5466634ANov 14, 1995
Electronic modules with interconnected surface metallization layers and fabrication methods therefore
IBM153 citations99
US5326430AJul 5, 1994
Cooling microfan arrangements and process
IBM174 citations99
US6279815B1Aug 28, 2001
Stacked chip process carrier
IBM254 citations98
US5399516AMar 21, 1995
Method of making shadow RAM cell having a shallow trench EEPROM
IBM185 citations98
US4962058AOct 9, 1990
Process for fabricating multi-level integrated circuit wiring structure from a single metal deposit
IBM215 citations98
US5913713AJun 22, 1999
CMP polishing pad backside modifications for advantageous polishing results
IBM95 citations97
US5872025AFeb 16, 1999
Method for stacked three dimensional device manufacture
IBM107 citations97
US5308438AMay 3, 1994
Endpoint detection apparatus and method for chemical/mechanical polishing
IBM197 citations97
US5196722AMar 23, 1993
Shadow ram cell having a shallow trench eeprom
IBM128 citations97
US5126006AJun 30, 1992
Plural level chip masking
IBM133 citations97
US4789648ADec 6, 1988
Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias
IBM526 citations97
US5532519AJul 2, 1996
Cube wireability enhancement with chip-to-chip alignment and thickness control
IBM70 citations96
US5517057AMay 14, 1996
Electronic modules with interconnected surface metallization layers
IBM87 citations96
US5453639ASep 26, 1995
Planarized semiconductor structure using subminimum features
IBM54 citations96
US5312777AMay 17, 1994
Fabrication methods for bidirectional field emission devices and storage structures
IBM64 citations96
US5308439AMay 3, 1994
Laternal field emmission devices and methods of fabrication
IBM56 citations96
US5296775AMar 22, 1994
Cooling microfan arrangements and process
IBM66 citations96
US5292689AMar 8, 1994
Method for planarizing semiconductor structure using subminimum features
IBM82 citations96
US5233263AAug 3, 1993
Lateral field emission devices
IBM69 citations96
US5194928AMar 16, 1993
Passivation of metal in metal/polyimide structure
IBM99 citations96
US5091289AFeb 25, 1992
Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions
IBM56 citations96
US4919750AApr 24, 1990
Etching metal films with complexing chloride plasma
IBM132 citations96
US4776087AOct 11, 1988
VLSI coaxial wiring structure
IBM96 citations96
US4755478AJul 5, 1988
Method of forming metal-strapped polysilicon gate electrode for FET device
IBM106 citations96
US5466636ANov 14, 1995
Method of forming borderless contacts using a removable mandrel
IBM63 citations95
US6143640ANov 7, 2000
Method of fabricating a stacked via in copper/polyimide beol
IBM55 citations93
US6137129AOct 24, 2000
High performance direct coupled FET memory cell
IBM27 citations93
US5602051AFeb 11, 1997
Method of making stacked electrical device having regions of electrical isolation and electrical connection on a given stack level
IBM30 citations93
US5539240AJul 23, 1996
Planarized semiconductor structure with subminimum features
IBM20 citations93
US5539255AJul 23, 1996
Semiconductor structure having self-aligned interconnection metallization formed from a single layer of metal
IBM35 citations93
US5496771AMar 5, 1996
Method of making overpass mask/insulator for local interconnects
IBM53 citations93
US5189506AFeb 23, 1993
Triple self-aligned metallurgy for semiconductor devices
IBM45 citations93
US4758306AJul 19, 1988
Stud formation method optimizing insulator gap-fill and metal hole-fill
IBM28 citations93
US6246583B1Jun 12, 2001
Method and apparatus for removing heat from a semiconductor device
IBM39 citations92
US6037661AMar 14, 2000
Multichip module
IBM21 citations92
US5567653AOct 22, 1996
Process for aligning etch masks on an integrated circuit surface using electromagnetic energy
IBM31 citations92
US5549511AAug 27, 1996
Variable travel carrier device and method for planarizing semiconductor wafers
IBM31 citations92
US5334467AAug 2, 1994
Gray level mask
IBM27 citations92
US5229257AJul 20, 1993
Process for forming multi-level coplanar conductor/insulator films employing photosensitive polymide polymer compositions
IBM22 citations92
US5213916AMay 25, 1993
Method of making a gray level mask
IBM45 citations92
PROSPORTS TECH LLC
3 patentsE INK CORP
1 patentARMSTRONG WORLD IND INC
1 patentGRANDIOS TECHNOLOGIES LLC
1 patentPROSPORTS TECHNOLOGIES LLC
1 patentShowing the top 50 of 113 patents by PatentIndex Score.