Inventor
CASEY WILLIAM J
US20 patents
⚠️ This page may combine multiple inventors who share the name “CASEY WILLIAM J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
5 patentsUS7213330B2May 8, 2007
Method of fabricating an electronic device
MICRON TECHNOLOGY INC17 citations91
US6974330B2Dec 13, 2005
Electronic devices incorporating electrical interconnections with improved reliability and methods of fabricating same
MICRON TECHNOLOGY INC21 citations91
US7119563B2Oct 10, 2006
Integrated circuit characterization printed circuit board
MICRON TECHNOLOGY INC7 citations71
US6924637B2Aug 2, 2005
Integrated circuit characterization printed circuit board, test equipment including same, method of fabrication thereof and method of characterizing an integrated circuit device
MICRON TECHNOLOGY INC10 citations71
US7271581B2Sep 18, 2007
Integrated circuit characterization printed circuit board, test equipment including same, method of fabrication thereof and method of characterizing an integrated circuit device
MICRON TECHNOLOGY INC0 citations50
REYNOLDS TOBACCO CO R
4 patentsUS5099861AMar 31, 1992
Aerosol delivery article
REYNOLDS TOBACCO CO R456 citations98
US5027837AJul 2, 1991
Cigarette
REYNOLDS TOBACCO CO R210 citations98
US5156170AOct 20, 1992
Cigarette
REYNOLDS TOBACCO CO R122 citations97
US5019122AMay 28, 1991
Smoking article with an enclosed heat conductive capsule containing an aerosol forming substance
REYNOLDS TOBACCO CO R439 citations96
MCMS INC
3 patentsUS6092714AJul 25, 2000
Method of utilizing a plasma gas mixture containing argon and CF4 to clean and coat a conductor
MCMS INC21 citations92
US6229218B1May 8, 2001
Interconnect device and method for mating dissimilar electronic package footprints
MCMS INC13 citations68
US6229210B1May 8, 2001
Device and method for attaching and soldering pre-formed solder spheres to the ball grid array (BGA) integrated circuit package attachment sites in high volume
MCMS INC4 citations62