Inventor
FAN ZHINENG
US19 patents
⚠️ This page may combine multiple inventors who share the name “FAN ZHINENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HIGH CONNECTION DENSITY INC
15 patentsUS6712621B2Mar 30, 2004
Thermally enhanced interposer and method
HIGH CONNECTION DENSITY INC129 citations97
US6551112B1Apr 22, 2003
Test and burn-in connector
HIGH CONNECTION DENSITY INC183 citations97
US6846184B2Jan 25, 2005
Low inductance electrical contacts and LGA connector system
HIGH CONNECTION DENSITY INC52 citations96
US6705877B1Mar 16, 2004
Stackable memory module with variable bandwidth
HIGH CONNECTION DENSITY INC153 citations96
US6312266B1Nov 6, 2001
Carrier for land grid array connectors
HIGH CONNECTION DENSITY INC51 citations95
US6722893B2Apr 20, 2004
Test and burn-in connector
HIGH CONNECTION DENSITY INC67 citations94
US6712620B1Mar 30, 2004
Coaxial elastomeric connector system
HIGH CONNECTION DENSITY INC45 citations92
US6663399B2Dec 16, 2003
Surface mount attachable land grid array connector and method of forming same
HIGH CONNECTION DENSITY INC49 citations92
US6471525B1Oct 29, 2002
Shielded carrier for land grid array connectors and a process for fabricating same
HIGH CONNECTION DENSITY INC39 citations92
US6381164B1Apr 30, 2002
Low profile, high density memory system
HIGH CONNECTION DENSITY INC33 citations92
US6723927B1Apr 20, 2004
High-reliability interposer for low cost and high reliability applications
HIGH CONNECTION DENSITY INC15 citations83
US6638077B1Oct 28, 2003
Shielded carrier with components for land grid array connectors
HIGH CONNECTION DENSITY INC18 citations83
US6370770B1Apr 16, 2002
Carrier for land grid array connectors
HIGH CONNECTION DENSITY INC15 citations83
US6590159B2Jul 8, 2003
Compact stacked electronic package
HIGH CONNECTION DENSITY INC11 citations73
US6546625B1Apr 15, 2003
Method of forming a contact member cable
HIGH CONNECTION DENSITY INC2 citations58