P

Inventor

LI CHE-YU

US44 patents
⚠️ This page may combine multiple inventors who share the name “LI CHE-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIGH CONNECTION DENSITY INC

24 patents
US6712621B2Mar 30, 2004

Thermally enhanced interposer and method

HIGH CONNECTION DENSITY INC129 citations97
US6551112B1Apr 22, 2003

Test and burn-in connector

HIGH CONNECTION DENSITY INC183 citations97
US6264476B1Jul 24, 2001

Wire segment based interposer for high frequency electrical connection

HIGH CONNECTION DENSITY INC226 citations97
US6846184B2Jan 25, 2005

Low inductance electrical contacts and LGA connector system

HIGH CONNECTION DENSITY INC52 citations96
US6705877B1Mar 16, 2004

Stackable memory module with variable bandwidth

HIGH CONNECTION DENSITY INC153 citations96
US6439894B1Aug 27, 2002

Contact assembly for land grid array interposer or electrical connector

HIGH CONNECTION DENSITY INC63 citations96
US6545895B1Apr 8, 2003

High capacity SDRAM memory module with stacked printed circuit boards

HIGH CONNECTION DENSITY INC124 citations95
US6312266B1Nov 6, 2001

Carrier for land grid array connectors

HIGH CONNECTION DENSITY INC51 citations95
US6722893B2Apr 20, 2004

Test and burn-in connector

HIGH CONNECTION DENSITY INC67 citations94
US6659778B2Dec 9, 2003

Contact assembly for land grid array interposer or electrical connector

HIGH CONNECTION DENSITY INC38 citations93
US6712620B1Mar 30, 2004

Coaxial elastomeric connector system

HIGH CONNECTION DENSITY INC45 citations92
US6663399B2Dec 16, 2003

Surface mount attachable land grid array connector and method of forming same

HIGH CONNECTION DENSITY INC49 citations92
US6471525B1Oct 29, 2002

Shielded carrier for land grid array connectors and a process for fabricating same

HIGH CONNECTION DENSITY INC39 citations92
US6381164B1Apr 30, 2002

Low profile, high density memory system

HIGH CONNECTION DENSITY INC33 citations92
US6480014B1Nov 12, 2002

High density, high frequency memory chip modules having thermal management structures

HIGH CONNECTION DENSITY INC46 citations91
US6597062B1Jul 22, 2003

Short channel, memory module with stacked printed circuit boards

HIGH CONNECTION DENSITY INC42 citations90
US6496380B1Dec 17, 2002

High capacity memory module with high electrical design margins

HIGH CONNECTION DENSITY INC19 citations89
US6661690B2Dec 9, 2003

High capacity memory module with built-in performance enhancing features

HIGH CONNECTION DENSITY INC22 citations88
US6540525B1Apr 1, 2003

High I/O stacked modules for integrated circuits

HIGH CONNECTION DENSITY INC33 citations88
US6723927B1Apr 20, 2004

High-reliability interposer for low cost and high reliability applications

HIGH CONNECTION DENSITY INC15 citations83
US6638077B1Oct 28, 2003

Shielded carrier with components for land grid array connectors

HIGH CONNECTION DENSITY INC18 citations83
US6370770B1Apr 16, 2002

Carrier for land grid array connectors

HIGH CONNECTION DENSITY INC15 citations83
US6590159B2Jul 8, 2003

Compact stacked electronic package

HIGH CONNECTION DENSITY INC11 citations73
US6742426B2Jun 1, 2004

Precision cutter for elastomeric cable

HIGH CONNECTION DENSITY INC4 citations54

CORNELL RES FOUNDATION INC

6 patents

RAINBOW DISPLAYS INC

5 patents

CHE YU LI & COMPANY LLC

5 patents

LI CHE-YU

4 patents