Inventor
RYMER J PATRICK
US2 patents
Patents
2 patentsUS6541371B1Apr 1, 2003
Apparatus and method for depositing superior Ta(N)/copper thin films for barrier and seed applications in semiconductor processing
NOVELLUS SYSTEMS INC17 citations91
US6905959B1Jun 14, 2005
Apparatus and method for depositing superior Ta (N) copper thin films for barrier and seed applications in semiconductor processing
NOVELLUS SYSTEMS INC14 citations82