Inventor
HOLLACK HARRY
US3 patents
Patents
3 patentsUS6441487B2Aug 27, 2002
Chip scale package using large ductile solder balls
FLIP CHIP TECHNOLOGIES L L C182 citations96
US6287893B1Sep 11, 2001
Method for forming chip scale package
FLIP CHIP TECHNOLOGIES L L C241 citations96
US6750135B2Jun 15, 2004
Method for forming chip scale package
FLIP CHIP TECHNOLOGIES L L C64 citations93