Inventor

ENDO TADASUKE

JP2 patents

Patents

2 patents

US8465837B2Jun 18, 2013

Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board

ENDO TADASUKE2 citations51

US8294268B2Oct 23, 2012

Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device

ENDO TADASUKE0 citations33