Inventor
YANAGITA KAZUTAKA
JP59 patents
⚠️ This page may combine multiple inventors who share the name “YANAGITA KAZUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CANON KK
39 patentsUS6624047B1Sep 23, 2003
Substrate and method of manufacturing the same
CANON KK150 citations99
US6426270B1Jul 30, 2002
Substrate processing method and method of manufacturing semiconductor substrate
CANON KK82 citations98
US6391743B1May 21, 2002
Method and apparatus for producing photoelectric conversion device
CANON KK88 citations98
US6382292B1May 7, 2002
Method and apparatus for separating composite member using fluid
CANON KK97 citations98
US6342433B1Jan 29, 2002
Composite member its separation method and preparation method of semiconductor substrate by utilization thereof
CANON KK96 citations98
US6376332B1Apr 23, 2002
Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing method
CANON KK93 citations97
US6946052B2Sep 20, 2005
Separating apparatus and processing method for plate member
CANON KK59 citations96
US6605518B1Aug 12, 2003
Method of separating composite member and process for producing thin film
CANON KK63 citations96
US6418999B1Jul 16, 2002
Sample separating apparatus and method, and substrate manufacturing method
CANON KK55 citations96
US6746559B2Jun 8, 2004
Method and apparatus for separating composite member using fluid
CANON KK33 citations93
US6672358B2Jan 6, 2004
Sample processing system
CANON KK33 citations93
US6653205B2Nov 25, 2003
Composite member separating method, thin film manufacturing method, and composite member separating apparatus
CANON KK35 citations93
US6629539B1Oct 7, 2003
Sample processing system
CANON KK25 citations93
US6597039B2Jul 22, 2003
Composite member, its separation method, and preparation method of semiconductor substrate by utilization thereof
CANON KK35 citations93
US6527031B1Mar 4, 2003
Sample separating apparatus and method, and substrate manufacturing method
CANON KK31 citations93
US6475323B1Nov 5, 2002
Method and apparatus for separating composite member using fluid
CANON KK33 citations93
US6380099B2Apr 30, 2002
Porous region removing method and semiconductor substrate manufacturing method
CANON KK30 citations93
US6979629B2Dec 27, 2005
Method and apparatus for processing composite member
CANON KK18 citations92
US6900114B2May 31, 2005
Separating apparatus, separating method, and method of manufacturing semiconductor substrate
CANON KK20 citations92
US6825099B2Nov 30, 2004
Method and apparatus for separating member
CANON KK30 citations92
US6653206B2Nov 25, 2003
Method and apparatus for processing composite member
CANON KK21 citations92
US6436226B1Aug 20, 2002
Object separating apparatus and method, and method of manufacturing semiconductor substrate
CANON KK31 citations92
US6427747B1Aug 6, 2002
Apparatus and method of separating sample and substrate fabrication method
CANON KK19 citations92
US6427748B1Aug 6, 2002
Sample processing apparatus and method
CANON KK20 citations92
US6767840B1Jul 27, 2004
Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
CANON KK36 citations90
US6199563B1Mar 13, 2001
Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
CANON KK39 citations90
US6833312B2Dec 21, 2004
Plate member separating apparatus and method
CANON KK14 citations84
US6127281AOct 3, 2000
Porous region removing method and semiconductor substrate manufacturing method
CANON KK18 citations84
US7017830B2Mar 28, 2006
Method and apparatus for separating sample
CANON KK8 citations74
US6971432B2Dec 6, 2005
Sample processing system
CANON KK5 citations74
US6712288B2Mar 30, 2004
Method and apparatus for separating sample
CANON KK8 citations74
US6391067B2May 21, 2002
Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
CANON KK10 citations74
US6867110B2Mar 15, 2005
Separating apparatus and processing method for plate member
CANON KK9 citations73
US6852187B2Feb 8, 2005
Method and apparatus for separating member
CANON KK8 citations73
US6609446B1Aug 26, 2003
Separating apparatus, separating method, and method of manufacturing semiconductor substrate
CANON KK9 citations73
US6609553B2Aug 26, 2003
Sample processing apparatus and method
CANON KK4 citations73
US6521078B2Feb 18, 2003
Sample separating apparatus and method, and substrate manufacturing method
CANON KK8 citations73
US6946046B2Sep 20, 2005
Method and apparatus for separating member
CANON KK3 citations62
US6860963B2Mar 1, 2005
Sample separating apparatus and method, and substrate manufacturing method
CANON KK3 citations62
HITACHI INT ELECTRIC INC
3 patentsUS9548198B2Jan 17, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC4 citations72
US9343290B2May 17, 2016
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC6 citations72
US8815751B2Aug 26, 2014
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC4 citations70
AIR LIQUIDE
2 patentsDUSSARRAT CHRISTIAN
1 patentL AIR LIQUIDE SOCIÉTÉ ANONYME POUR L ETUDE ET L EXPL DES PROCÉDÉS GEORGES CLAUDE
1 patentGATINEAU JULIEN
1 patentOKUBO SHINGO
1 patentCANON KABUHSIKI KAISHA
1 patentL'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude
1 patentShowing the top 50 of 59 patents by PatentIndex Score.