Inventor
PARK HWAN-PIL
KR7 patents
⚠️ This page may combine multiple inventors who share the name “PARK HWAN-PIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
6 patentsUS11876083B2Jan 16, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11239175B2Feb 1, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations57
US11948873B2Apr 2, 2024
Semiconductor package including a support solder ball
SAMSUNG ELECTRONICS CO LTD0 citations51
US11908806B2Feb 20, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11854989B2Dec 26, 2023
Semiconductor package substrate and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12283578B2Apr 22, 2025
Semiconductor package and method of fabricating same
SAMSUNG ELECTRONICS CO LTD0 citations50