Inventor
KOBURGER III CHARLES WILLIAM
US69 patents
⚠️ This page may combine multiple inventors who share the name “KOBURGER III CHARLES WILLIAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
49 patentsUS6875703B1Apr 5, 2005
Method for forming quadruple density sidewall image transfer (SIT) structures
IBM286 citations99
US6713835B1Mar 30, 2004
Method for manufacturing a multi-level interconnect structure
IBM297 citations99
US7135773B2Nov 14, 2006
Integrated circuit chip utilizing carbon nanotube composite interconnection vias
IBM49 citations96
US7691720B2Apr 6, 2010
Vertical nanotube semiconductor device structures and methods of forming the same
IBM22 citations93
US7607455B2Oct 27, 2009
Micro-electro-mechanical valves and pumps and methods of fabricating same
IBM21 citations93
US7483285B2Jan 27, 2009
Memory devices using carbon nanotube (CNT) technologies
IBM27 citations93
US7351666B2Apr 1, 2008
Layout and process to contact sub-lithographic structures
IBM36 citations93
US7276768B2Oct 2, 2007
Semiconductor structures for latch-up suppression and methods of forming such semiconductor structures
IBM30 citations93
US7271444B2Sep 18, 2007
Wrap-around gate field effect transistor
IBM16 citations93
US7229909B2Jun 12, 2007
Integrated circuit chip utilizing dielectric layer having oriented cylindrical voids formed from carbon nanotubes
IBM24 citations93
US7102201B2Sep 5, 2006
Strained semiconductor device structures
IBM23 citations93
US7088422B2Aug 8, 2006
Moving lens for immersion optical lithography
IBM29 citations93
US7038299B2May 2, 2006
Selective synthesis of semiconducting carbon nanotubes
IBM40 citations93
US8896067B2Nov 25, 2014
Method of forming finFET of variable channel width
IBM20 citations92
US7473633B2Jan 6, 2009
Method for making integrated circuit chip having carbon nanotube composite interconnection vias
IBM29 citations92
US6970372B1Nov 29, 2005
Dual gated finfet gain cell
IBM37 citations92
US6890828B2May 10, 2005
Method for supporting a bond pad in a multilevel interconnect structure and support structure formed thereby
IBM26 citations92
US7374793B2May 20, 2008
Methods and structures for promoting stable synthesis of carbon nanotubes
IBM31 citations91
US6989308B2Jan 24, 2006
Method of forming FinFET gates without long etches
IBM24 citations91
US8941156B2Jan 27, 2015
Self-aligned dielectric isolation for FinFET devices
IBM13 citations84
US7932167B2Apr 26, 2011
Phase change memory cell with vertical transistor
IBM7 citations84
US7829883B2Nov 9, 2010
Vertical carbon nanotube field effect transistors and arrays
IBM10 citations84
US7699996B2Apr 20, 2010
Sidewall image transfer processes for forming multiple line-widths
IBM9 citations84
US7674674B2Mar 9, 2010
Method of forming a dual gated FinFET gain cell
IBM13 citations84
US7655985B2Feb 2, 2010
Methods and semiconductor structures for latch-up suppression using a conductive region
IBM9 citations84
US7645676B2Jan 12, 2010
Semiconductor structures for latch-up suppression and methods of forming such semiconductor structures
IBM8 citations84
US7566613B2Jul 28, 2009
Method of forming a dual gated FinFET gain cell
IBM11 citations84
US7505110B2Mar 17, 2009
Micro-electro-mechanical valves and pumps
IBM11 citations84
US7491618B2Feb 17, 2009
Methods and semiconductor structures for latch-up suppression using a conductive region
IBM9 citations84
US7273794B2Sep 25, 2007
Shallow trench isolation fill by liquid phase deposition of SiO2
IBM13 citations84
US7791145B2Sep 7, 2010
Semiconductor structures for latch-up suppression and methods of forming such semiconductor structures
IBM6 citations74
US7727848B2Jun 1, 2010
Methods and semiconductor structures for latch-up suppression using a conductive region
IBM5 citations74
US7560347B2Jul 14, 2009
Methods for forming a wrap-around gate field effect transistor
IBM5 citations74
US7439081B2Oct 21, 2008
Method for making integrated circuit chip utilizing oriented carbon nanotube conductive layers
IBM6 citations74
US7129097B2Oct 31, 2006
Integrated circuit chip utilizing oriented carbon nanotube conductive layers
IBM9 citations74
US7397692B1Jul 8, 2008
High performance single event upset hardened SRAM cell
IBM7 citations73
US5894169AApr 13, 1999
Low-leakage borderless contacts to doped regions
IBM8 citations68
US7985643B2Jul 26, 2011
Semiconductor transistors with contact holes close to gates
IBM3 citations63
US7825525B2Nov 2, 2010
Layout and process to contact sub-lithographic structures
IBM3 citations63
US7704855B2Apr 27, 2010
Method for fabricating strained silicon-on-insulator structures and strained silicon-on-insulator structures formed thereby
IBM3 citations63
US7668004B2Feb 23, 2010
Non-volatile switching and memory devices using vertical nanotubes
IBM5 citations63
US7579272B2Aug 25, 2009
Methods of forming low-k dielectric layers containing carbon nanostructures
IBM3 citations63
US7492046B2Feb 17, 2009
Electric fuses using CNTs (carbon nanotubes)
IBM6 citations63
US7385839B2Jun 10, 2008
Memory devices using carbon nanotube (CNT) technologies
IBM5 citations63
US7268028B1Sep 11, 2007
Well isolation trenches (WIT) for CMOS devices
IBM3 citations63
US7264415B2Sep 4, 2007
Methods of forming alternating phase shift masks having improved phase-shift tolerance
IBM4 citations63
US7898045B2Mar 1, 2011
Passive electrically testable acceleration and voltage measurement devices
IBM2 citations62
US7651902B2Jan 26, 2010
Hybrid substrates and methods for forming such hybrid substrates
IBM2 citations62
US7648869B2Jan 19, 2010
Method of fabricating semiconductor structures for latch-up suppression
IBM5 citations62
FURUKAWA TOSHIHARU
1 patentShowing the top 50 of 69 patents by PatentIndex Score.