Inventor
TAN AIPING
CN9 patents
⚠️ This page may combine multiple inventors who share the name “TAN AIPING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS11538746B2Dec 27, 2022
Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same
INTEL CORP3 citations72
US11081451B2Aug 3, 2021
Die stack with reduced warpage
INTEL CORP2 citations72
US10991679B2Apr 27, 2021
Stair-stacked dice device in a system in package, and methods of making same
INTEL CORP2 citations72
US10930622B2Feb 23, 2021
Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same
INTEL CORP2 citations72
US10770434B2Sep 8, 2020
Stair-stacked dice device in a system in package, and methods of making same
INTEL CORP2 citations72
US10727208B2Jul 28, 2020
Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same
INTEL CORP2 citations72
US11848281B2Dec 19, 2023
Die stack with reduced warpage
INTEL CORP0 citations61
US10971478B2Apr 6, 2021
Interposer design in package structures for wire bonding applications
INTEL CORP0 citations59