Inventor
TANDON SHAKUL
US5 patents
Patents
5 patentsUS10395883B2Aug 27, 2019
Aperture size modulation to enhance ebeam patterning resolution
INTEL CORP3 citations65
US11581162B2Feb 14, 2023
Fill pattern to enhance ebeam process margin
INTEL CORP0 citations59
US11107658B2Aug 31, 2021
Fill pattern to enhance e-beam process margin
INTEL CORP0 citations59
US12438102B2Oct 7, 2025
Hermetic barrier surrounding a plurality of dies
INTEL CORP0 citations55
US10338474B2Jul 2, 2019
Underlying absorbing or conducting layer for Ebeam direct write (EBDW) lithography
INTEL CORP0 citations50