Inventor
SINHA ARVIND KUMAR
US32 patents
⚠️ This page may combine multiple inventors who share the name “SINHA ARVIND KUMAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
25 patentsUS6970360B2Nov 29, 2005
Tamper-proof enclosure for a circuit card
IBM127 citations98
US7214874B2May 8, 2007
Venting device for tamper resistant electronic modules
IBM77 citations97
US6385044B1May 7, 2002
Heat pipe heat sink assembly for cooling semiconductor chips
IBM88 citations97
US7298623B1Nov 20, 2007
Organic substrate with integral thermal dissipation channels, and method for producing same
IBM53 citations96
US7606033B2Oct 20, 2009
Mounting a heat sink in thermal contact with an electronic component
IBM18 citations92
US7486516B2Feb 3, 2009
Mounting a heat sink in thermal contact with an electronic component
IBM32 citations92
US7382620B2Jun 3, 2008
Method and apparatus for optimizing heat transfer with electronic components
IBM22 citations92
US6449155B1Sep 10, 2002
Land grid array subassembly for multichip modules
IBM48 citations92
US7944698B2May 17, 2011
Mounting a heat sink in thermal contact with an electronic component
IBM9 citations84
US7832096B2Nov 16, 2010
Method for producing an organic substrate with integral thermal dissipation channels
IBM11 citations84
US7472477B2Jan 6, 2009
Method for manufacturing a socket that compensates for differing coefficients of thermal expansion
IBM8 citations84
US7438557B1Oct 21, 2008
Stacked multiple electronic component interconnect structure
IBM9 citations84
US6988533B2Jan 24, 2006
Method and apparatus for mounting a heat transfer apparatus upon an electronic component
IBM11 citations84
US7068510B2Jun 27, 2006
Dissipating heat reliably in computer systems
IBM17 citations82
US7438558B1Oct 21, 2008
Three-dimensional stackable die configuration for an electronic circuit board
IBM8 citations74
US7632127B2Dec 15, 2009
Socket and method for compensating for differing coefficients of thermal expansion
IBM6 citations73
US7303443B1Dec 4, 2007
Socket and method for compensating for differing coefficients of thermal expansion
IBM8 citations73
US7535714B1May 19, 2009
Apparatus and method providing metallic thermal interface between metal capped module and heat sink
IBM4 citations63
US6718269B2Apr 6, 2004
Apparatus, program product and method of estimating the stress intensity factor ratio of a material
IBM6 citations63
US7530853B2May 12, 2009
Socket and method for compensating for differing coefficients of thermal expansion
IBM2 citations62
US7071720B2Jul 4, 2006
Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit
IBM2 citations62
US6792375B2Sep 14, 2004
Apparatus, system, and method of determining loading characteristics on an integrated circuit module
IBM5 citations62
US7339266B2Mar 4, 2008
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
IBM4 citations60
US7317514B2Jan 8, 2008
System and method for optimizing heat management
IBM0 citations51
US7550840B2Jun 23, 2009
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
IBM0 citations50
KUCZYNSKI JOSEPH
3 patentsUS9096784B2Aug 4, 2015
Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance
KUCZYNSKI JOSEPH2 citations61
US8431048B2Apr 30, 2013
Method and system for alignment of graphite nanofibers for enhanced thermal interface material performance
KUCZYNSKI JOSEPH3 citations61
US8750704B2Jun 10, 2014
Implementing reduced signal degradation for fiber optic modules
KUCZYNSKI JOSEPH0 citations42