Inventor

HIATT WILLIAM MARK

US18 patents

⚠️ This page may combine multiple inventors who share the name “HIATT WILLIAM MARK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIATT WILLIAM MARK

MICRON TECHNOLOGY INC

Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Through-wafer interconnects for photoimager and memory wafers

Methods for fabricating and filling conductive vias and conductive vias so formed

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages

Semiconductor devices comprising nickel- and copper-containing interconnects

Semiconductor devices comprising nickel— and copper—containing interconnects

Methods of forming interconnects and semiconductor structures

Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages

APTINA IMAGING CORP

Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Methods of packaging microelectronic imaging devices

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

MOTOROLA INC

Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection

Wafer carrier transport system for tool bays

AKRAM SALMAN

Methods of forming conductive vias

Methods for fabricating and filling conductive vias and conductive vias so formed