Inventor

BENSON PETER A

US30 patents

⚠️ This page may combine multiple inventors who share the name “BENSON PETER A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BENSON PETER A

MICRON TECHNOLOGY INC

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Microelectronics devices, having vias, and packaged microelectronic devices having vias

Methods for packaging microfeature devices and microfeature devices formed by such methods

Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies

Low temperature methods of forming back side redistribution layers in association with through wafer interconnects

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Microelectronic imagers and methods of packaging microelectronic imagers

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices

Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies

Microelectronic imagers and methods of packaging microelectronic imagers

Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies

Methods of packaging and testing microelectronic imaging devices

Wafer edge ring structures and methods of formation

Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques

Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects

Apparatus for spin coating semiconductor substrates

Systems and methods for retrieving residual liquid during immersion lens photolithography

Methods for packing microfeature devices and microfeature devices formed by such methods

Semiconductor wafer assemblies

Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers

Substrate supports for use with programmable material consolidation apparatus and systems

APTINA IMAGING CORP

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

BENSON PETER A

Non-chemical, non-optical edge bead removal process

Non-chemical, non-optical edge bead removal process

SHIPLEY CO LLC

Composition for circuit board manufacture

AKRAM SALMAN

Wafer-level packaged microelectronic imagers having interconnects formed through terminals