Inventor
CHIKARMANE VINAY
US7 patents
Patents
7 patentsUS11581419B2Feb 14, 2023
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
INTEL CORP2 citations82
US10854731B2Dec 1, 2020
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
INTEL CORP1 citations82
US10777655B2Sep 15, 2020
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
INTEL CORP3 citations82
US11955534B2Apr 9, 2024
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
INTEL CORP1 citations61
US7768126B2Aug 3, 2010
Barrier formation and structure to use in semiconductor devices
INTEL CORP2 citations61
US7525197B2Apr 28, 2009
Barrier process/structure for transistor trench contact applications
INTEL CORP3 citations61
US7371311B2May 13, 2008
Modified electroplating solution components in a low-acid electrolyte solution
INTEL CORP3 citations61