Inventor
ZHANG TONGLONG
US13 patents
⚠️ This page may combine multiple inventors who share the name “ZHANG TONGLONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BROADCOM CORP
11 patentsUS7259448B2Aug 21, 2007
Die-up ball grid array package with a heat spreader and method for making the same
BROADCOM CORP61 citations97
US7259457B2Aug 21, 2007
Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same
BROADCOM CORP46 citations96
US7411281B2Aug 12, 2008
Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
BROADCOM CORP32 citations92
US7326061B2Feb 5, 2008
Via providing multiple electrically conductive paths
BROADCOM CORP22 citations92
US7168957B2Jan 30, 2007
Via providing multiple electrically conductive paths
BROADCOM CORP21 citations92
US7094060B2Aug 22, 2006
Via providing multiple electrically conductive paths
BROADCOM CORP27 citations92
US6848912B2Feb 1, 2005
Via providing multiple electrically conductive paths through a circuit board
BROADCOM CORP27 citations92
US7704800B2Apr 27, 2010
Semiconductor assembly with one metal layer after base metal removal
BROADCOM CORP8 citations83
US7985631B2Jul 26, 2011
Semiconductor assembly with one metal layer after base metal removal
BROADCOM CORP4 citations62
US7595227B2Sep 29, 2009
Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
BROADCOM CORP3 citations62
US9237651B2Jan 12, 2016
Padless via
BROADCOM CORP1 citations51