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Inventor
STEFANER WERNER
AT
2 patents
⚠️ This page may combine multiple inventors who share the name “STEFANER WERNER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SIEMENS AG
1 patent
US6309965B1
Oct 30, 2001
Method of producing a semiconductor body with metallization on the back side that includes a titanium nitride layer to reduce warping
SIEMENS AG
25 citations
86
INFINEON TECHNOLOGIES AG
1 patent
US6147403A
Nov 14, 2000
Semiconductor body with metallizing on the back side
INFINEON TECHNOLOGIES AG
21 citations
86