Inventor

CARSON FLYNN

US30 patents

⚠️ This page may combine multiple inventors who share the name “CARSON FLYNN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CARSON FLYNN

CHIPPAC INC

Semiconductor multi-package module having inverted bump chip carrier second package

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Method for manufacturing plastic ball grid array with integral heatsink

Method for making a semiconductor multi-package module having inverted wire bond carrier second package

Method for making a semiconductor multi-package module having inverted bump chip carrier second package

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Plastic semiconductor package

Plastic ball grid array package with integral heatsink

Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Plastic ball grid array package with integral heatsink

Method for manufacturing plastic ball grid array package with integral heatsink

STATS CHIPPAC LTD

Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides

Method of fabricating a stacked integrated circuit package system

Stacked integrated circuit package system

Stacked integrated circuit package system and method of manufacture therefor

Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages

Integrated circuit package system with stacking module

TESSERA INC

Semiconductor inner lead bonding tool

Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor

Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor

CHANDRA HARRY

Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground

Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die

Integrated circuit package system with input/output expansion

CARSON FLYNN

Stacked integrated circuit package system and method for manufacturing thereof

Mountable integrated circuit package system with substrate having a conductor-free recess

PENDSE RAJENDRA D

Integrated circuit package system for package stacking and method of manufacture therefor

PAGAILA REZA A

Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die

JCET SEMICONDUCTOR SHAOXING CO LTD

Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die

HA JONG-WOO

Stacked integrated circuit package system

BATHAN HENRY DESCALZO

Integrated circuit packaging system with pad connection and method of manufacture thereof