Inventor
KOYAMA TOSHINORI
JP20 patents
Patents
20 patentsUS7057290B2Jun 6, 2006
Electronic parts packaging structure and method of manufacturing the same
SHINKO ELECTRIC IND CO30 citations93
US7285862B2Oct 23, 2007
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
SHINKO ELECTRIC IND CO27 citations92
US6254758B1Jul 3, 2001
Method of forming conductor pattern on wiring board
SHINKO ELECTRIC IND CO28 citations92
US6759600B2Jul 6, 2004
Multilayer wiring board and method of fabrication thereof
SHINKO ELECTRIC IND CO35 citations90
US6350365B1Feb 26, 2002
Method of producing multilayer circuit board
SHINKO ELECTRIC IND CO36 citations90
US9820391B2Nov 14, 2017
Wiring board
SHINKO ELECTRIC IND CO11 citations84
US9167692B2Oct 20, 2015
Wiring board, semiconductor device, and method of manufacturing wiring board
SHINKO ELECTRIC IND CO11 citations84
US9620446B2Apr 11, 2017
Wiring board, electronic component device, and method for manufacturing those
SHINKO ELECTRIC IND CO7 citations83
US9520352B2Dec 13, 2016
Wiring board and semiconductor device
SHINKO ELECTRIC IND CO11 citations83
US9455219B2Sep 27, 2016
Wiring substrate and method of manufacturing the same
SHINKO ELECTRIC IND CO8 citations83
US6560863B2May 13, 2003
Method of producing wiring board
SHINKO ELECTRIC IND CO13 citations81
US7964950B2Jun 21, 2011
Electronic parts packaging structure and method of manufacturing the same
SHINKO ELECTRIC IND CO5 citations74
US7691673B2Apr 6, 2010
Electronic parts packaging structure and method of manufacturing the same
SHINKO ELECTRIC IND CO4 citations74
US7573135B2Aug 11, 2009
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
SHINKO ELECTRIC IND CO6 citations74
US7545049B2Jun 9, 2009
Electronic parts packaging structure
SHINKO ELECTRIC IND CO5 citations74
US7498200B2Mar 3, 2009
Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
SHINKO ELECTRIC IND CO7 citations74
US9220167B2Dec 22, 2015
Wiring substrate, semiconductor device, and method of manufacturing wiring substrate
SHINKO ELECTRIC IND CO5 citations73
US7495745B2Feb 24, 2009
Patterning method and computer readable medium therefor
SHINKO ELECTRIC IND CO2 citations62
US7307691B2Dec 11, 2007
Maskless direct exposure system and user interface
SHINKO ELECTRIC IND CO1 citations52
US9380707B2Jun 28, 2016
Method of manufacturing wiring substrate
SHINKO ELECTRIC IND CO0 citations41