Inventor
MACQUARRIE STEPHEN W
US8 patents
Patents
8 patentsUS6212076B1Apr 3, 2001
Enhanced heat-dissipating printed circuit board package
IBM61 citations95
US6650016B1Nov 18, 2003
Selective C4 connection in IC packaging
IBM23 citations92
US6522014B1Feb 18, 2003
Fabrication of a metalized blind via
IBM23 citations91
US5952716ASep 14, 1999
Pin attach structure for an electronic package
IBM33 citations90
US7737550B2Jun 15, 2010
Optimization of electronic package geometry for thermal dissipation
IBM10 citations82
US6438830B1Aug 27, 2002
Process of producing plastic pin grid array
IBM14 citations82
US6576549B2Jun 10, 2003
Fabrication of a metalized blind via
IBM5 citations72
US6131278AOct 17, 2000
Metal substrate having an IC chip and carrier mounting
IBM7 citations72