Inventor
PALANDUZ CENGIZ A
US32 patents
⚠️ This page may combine multiple inventors who share the name “PALANDUZ CENGIZ A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
26 patentsUS7290315B2Nov 6, 2007
Method for making a passive device structure
INTEL CORP18 citations92
US7209366B2Apr 24, 2007
Delivery regions for power, ground and I/O signal paths in an IC package
INTEL CORP44 citations92
US7081650B2Jul 25, 2006
Interposer with signal and power supply through vias
INTEL CORP35 citations91
US7375412B1May 20, 2008
iTFC with optimized C(T)
INTEL CORP10 citations84
US7242073B2Jul 10, 2007
Capacitor having an anodic metal oxide substrate
INTEL CORP11 citations84
US7095108B2Aug 22, 2006
Array capacitors in interposers, and methods of using same
INTEL CORP16 citations84
US7986532B2Jul 26, 2011
Split thin film capacitor for multiple voltages
INTEL CORP4 citations74
US7586756B2Sep 8, 2009
Split thin film capacitor for multiple voltages
INTEL CORP4 citations74
US7504271B2Mar 17, 2009
Integrated circuit package substrate having a thin film capacitor structure
INTEL CORP6 citations74
US7453144B2Nov 18, 2008
Thin film capacitors and methods of making the same
INTEL CORP6 citations74
US7216406B2May 15, 2007
Method forming split thin film capacitors with multiple voltages
INTEL CORP5 citations74
US7132743B2Nov 7, 2006
Integrated circuit package substrate having a thin film capacitor structure
INTEL CORP10 citations74
US7011726B1Mar 14, 2006
Method of fabricating thin dielectric film and thin film capacitor including the dielectric film
INTEL CORP8 citations74
US7675160B2Mar 9, 2010
Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor
INTEL CORP6 citations73
US7638928B2Dec 29, 2009
Piezo actuator for cooling
INTEL CORP7 citations71
US7629269B2Dec 8, 2009
High-k thin film grain size control
INTEL CORP6 citations63
US7547957B2Jun 16, 2009
Thin film capacitors and methods of making the same
INTEL CORP3 citations63
US7099139B2Aug 29, 2006
Integrated circuit package substrate having a thin film capacitor structure
INTEL CORP2 citations63
US7755165B2Jul 13, 2010
iTFC with optimized C(T)
INTEL CORP1 citations62
US7733626B2Jun 8, 2010
Passive device structure
INTEL CORP3 citations62
US7224571B2May 29, 2007
Forming a substrate core with embedded capacitor and structures formed thereby
INTEL CORP2 citations62
US7810234B2Oct 12, 2010
Method of forming a thin film capacitor
INTEL CORP0 citations52
US7656644B2Feb 2, 2010
iTFC with optimized C(T)
INTEL CORP0 citations52
US7636231B2Dec 22, 2009
Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same
INTEL CORP0 citations52
US7372126B2May 13, 2008
Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same
INTEL CORP0 citations52
US7176575B2Feb 13, 2007
Input/output routing on an electronic device
INTEL CORP1 citations51