Inventor

WOOD DUSTIN P

US26 patents

⚠️ This page may combine multiple inventors who share the name “WOOD DUSTIN P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WOOD DUSTIN P

INTEL CORP

Multilayer capacitor with multiple plates per layer

Chip package with degassing holes

Array capacitor for decoupling multiple voltage rails

iTFC with optimized C(T)

Integrated circuit packaging architecture

Integrated circuit package with improved power signal connection

Integrated circuit package with improved power signal connection

Array capacitors with voids to enable a full-grid socket

Array capacitor with IC contacts and applications

Selective plating of package terminals

Selective plating of package terminals

iTFC with optimized C(T)

Integrated circuit packages, systems, and methods

Integrated circuit packages, systems, and methods

Array capacitors with voids to enable a full-grid socket

Chip package with degassing holes

Chip package with degassing holes

Package substrate for integrated circuit and method of making the substrate

Integrated circuit package substrate

iTFC with optimized C(T)

Interconnect shunt used for current distribution and reliability redundancy

Integrated circuit package with improved power signal connection

Interconnect shunt used for current distribution and reliability redundancy

Array capacitor with resistive structure

Array capacitors for broadband decoupling applications

MANUSHAROW MATHEW J

Integrated circuit package substrate