P

Inventor

JUNG SOON-MOON

KR66 patents
⚠️ This page may combine multiple inventors who share the name “JUNG SOON-MOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

46 patents
US7589375B2Sep 15, 2009

Non-volatile memory devices including etching protection layers and methods of forming the same

SAMSUNG ELECTRONICS CO LTD271 citations98
US6806180B2Oct 19, 2004

Unitary interconnection structures integral with a dielectric layer

SAMSUNG ELECTRONICS CO LTD52 citations96
US6376368B1Apr 23, 2002

Method of forming contact structure in a semiconductor device

SAMSUNG ELECTRONICS CO LTD63 citations94
US6335279B2Jan 1, 2002

Method of forming contact holes of semiconductor device

SAMSUNG ELECTRONICS CO LTD53 citations93
US5852572ADec 22, 1998

Small-sized static random access memory cell

SAMSUNG ELECTRONICS CO LTD26 citations93
US7719033B2May 18, 2010

Semiconductor devices having thin film transistors and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD20 citations92
US7701771B2Apr 20, 2010

Memory device including 3-dimensionally arranged memory cell transistors and methods of operating the same

SAMSUNG ELECTRONICS CO LTD33 citations92
US7683404B2Mar 23, 2010

Stacked memory and method for forming the same

SAMSUNG ELECTRONICS CO LTD32 citations92
US7646664B2Jan 12, 2010

Semiconductor device with three-dimensional array structure

SAMSUNG ELECTRONICS CO LTD35 citations92
US7602028B2Oct 13, 2009

NAND flash memory devices having 3-dimensionally arranged memory cells and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD23 citations92
US7479673B2Jan 20, 2009

Semiconductor integrated circuits with stacked node contact structures

SAMSUNG ELECTRONICS CO LTD30 citations92
US7312144B2Dec 25, 2007

Unitary interconnection structures integral with a dielectric layer and fabrication methods thereof

SAMSUNG ELECTRONICS CO LTD24 citations92
US7982221B2Jul 19, 2011

Semiconductor memory device having three dimensional structure

SAMSUNG ELECTRONICS CO LTD15 citations91
US7825472B2Nov 2, 2010

Semiconductor device having a plurality of stacked transistors and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD21 citations91
US7315466B2Jan 1, 2008

Semiconductor memory device and method for arranging and manufacturing the same

SAMSUNG ELECTRONICS CO LTD27 citations91
US8040733B2Oct 18, 2011

Non-volatile memory device and method of operating the same

SAMSUNG ELECTRONICS CO LTD9 citations84
US8026504B2Sep 27, 2011

Semiconductor device and method of forming the same

SAMSUNG ELECTRONICS CO LTD7 citations84
US7626228B2Dec 1, 2009

NAND-type non-volatile memory devices having a stacked structure

SAMSUNG ELECTRONICS CO LTD18 citations84
US7521715B2Apr 21, 2009

Node contact structures in semiconductor devices

SAMSUNG ELECTRONICS CO LTD19 citations84
US7511297B2Mar 31, 2009

Phase change memory device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD17 citations84
US7417286B2Aug 26, 2008

Semiconductor integrated circuit devices having single crystalline thin film transistors and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD9 citations84
US7387919B2Jun 17, 2008

Methods of fabricating a semiconductor device having a node contact structure of a CMOS inverter

SAMSUNG ELECTRONICS CO LTD18 citations84
US8004885B2Aug 23, 2011

Three-dimensional memory device and driving method thereof

SAMSUNG ELECTRONICS CO LTD15 citations83
US7795651B2Sep 14, 2010

One transistor DRAM device and method of forming the same

SAMSUNG ELECTRONICS CO LTD5 citations74
US7432560B2Oct 7, 2008

Body-tied-to-source MOSFETs with asymmetrical source and drain regions and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD8 citations74
US7276421B2Oct 2, 2007

Method of forming single crystal semiconductor thin film on insulator and semiconductor device fabricated thereby

SAMSUNG ELECTRONICS CO LTD9 citations74
US7586135B2Sep 8, 2009

Multilevel integrated circuit devices and methods of forming the same

SAMSUNG ELECTRONICS CO LTD7 citations73
US7151031B2Dec 19, 2006

Methods of fabricating semiconductor devices having gate insulating layers with differing thicknesses

SAMSUNG ELECTRONICS CO LTD7 citations73
US6870231B2Mar 22, 2005

Layouts for CMOS SRAM cells and devices

SAMSUNG ELECTRONICS CO LTD11 citations73
US7589992B2Sep 15, 2009

Semiconductor device having three dimensional structure

SAMSUNG ELECTRONICS CO LTD7 citations72
US7960844B2Jun 14, 2011

3-dimensional flash memory device, method of fabrication and method of operation

SAMSUNG ELECTRONICS CO LTD6 citations63
US7910433B2Mar 22, 2011

Methods of fabricating multi-layer nonvolatile memory devices

SAMSUNG ELECTRONICS CO LTD2 citations63
US7554140B2Jun 30, 2009

Nand-type non-volatile memory device

SAMSUNG ELECTRONICS CO LTD3 citations63
US7276404B2Oct 2, 2007

Methods of forming SRAM cells having landing pad in contact with upper and lower cell gate patterns

SAMSUNG ELECTRONICS CO LTD3 citations63
US7247528B2Jul 24, 2007

Methods of fabricating semiconductor integrated circuits using selective epitaxial growth and partial planarization techniques

SAMSUNG ELECTRONICS CO LTD4 citations63
US7193276B2Mar 20, 2007

Semiconductor devices with a source/drain regions formed on a recessed portion of an isolation layer

SAMSUNG ELECTRONICS CO LTD5 citations63
US7170133B2Jan 30, 2007

Transistor and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US7141851B2Nov 28, 2006

Transistors having a recessed channel region

SAMSUNG ELECTRONICS CO LTD3 citations63
US7135746B2Nov 14, 2006

SRAM cells having landing pad in contact with upper and lower cell gate patterns and methods of forming the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US8343812B2Jan 1, 2013

Contact structures in substrate having bonded interface, semiconductor device including the same, methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations62
US8034668B2Oct 11, 2011

Method for forming semiconductor device having metallization comprising select lines, bit lines and word lines

SAMSUNG ELECTRONICS CO LTD3 citations62
US7978561B2Jul 12, 2011

Semiconductor memory devices having vertically-stacked transistors therein

SAMSUNG ELECTRONICS CO LTD3 citations62
US7601998B2Oct 13, 2009

Semiconductor memory device having metallization comprising select lines, bit lines and word lines

SAMSUNG ELECTRONICS CO LTD1 citations62
US7592625B2Sep 22, 2009

Semiconductor transistor with multi-level transistor structure and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD3 citations62
US7312110B2Dec 25, 2007

Methods of fabricating semiconductor devices having thin film transistors

SAMSUNG ELECTRONICS CO LTD6 citations62
US7405450B2Jul 29, 2008

Semiconductor devices having high conductivity gate electrodes with conductive line patterns thereon

SAMSUNG ELECTRONICS CO LTD3 citations61

LEE JAE DUK

1 patent

UNIV FLORIDA

1 patent

JEONG JAE-HUN

1 patent

PARK JUN-BEOM

1 patent

Showing the top 50 of 66 patents by PatentIndex Score.