Inventor

HAYASAKA NOBUO

JP71 patents

⚠️ This page may combine multiple inventors who share the name “HAYASAKA NOBUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HAYASAKA NOBUO

TOSHIBA KK

Multichip semiconductor device, chip therefor and method of formation thereof

Multichip semiconductor device and memory card

Method of filling contact holes and wiring grooves of a semiconductor device

Method of oxide etching with condensed plasma reaction product

Method for fabricating a probe pin for testing electrical characteristics of an apparatus

Passive semiconductor device mounted as daughter chip on active semiconductor device

Chemical mechanical method of polishing wafer surfaces

Semiconductor processing system and method of using the same

Polishing method and polishing apparatus

Polishing agent and polishing method using the same

Semiconductor device having a metal film formed in a groove in an insulating film

Polishing method and polishing apparatus

Stacked type semiconductor device

Method of manufacturing silicon oxide film containing fluorine

Semiconductor device and method of manufacturing the same

Hot plate and semiconductor device manufacturing method using the same

Method for production of semiconductor device

Paste connection plug, burying method, and semiconductor device manufacturing method

CVD apparatus with high throughput and cleaning method therefor

Method for production of semiconductor device

Polishing pad, polishing apparatus and polishing method

Method for forming an electrode and/or wiring layer by reducing copper oxide or silver oxide

Charged beam irradiating apparatus having a cleaning means and a method of cleaning a charged beam irradiating apparatus

Method for making aluminum single crystal interconnections on insulators

Method of cleaning a charged beam apparatus

Method for removing composite attached to material by dry etching

Measurement system and measurement method

Multichip semiconductor device, chip therefor and method of formation thereof

Multichip semiconductor device, chip therefor and method of formation thereof

Probe pin for testing electrical characteristics of apparatus, probe card using probe pins

Semiconductor device using damascene technique and manufacturing method therefor

Deposition apparatus

Method for manufacturing a semiconductor device

Semiconductor device having a single-crystal metal wiring

Pattern-forming method

Method of manufacturing semiconductor device

Manufacturing system in electronic devices

Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device

Semiconductor device having an electrode structure comprising a conductive fine particle film

Polishing method and polisher used in the method

Method of manufacture of semiconductor device

Method of manufacturing semiconductor metal wiring layer by reduction of metal oxide

Semiconductor device

Method of forming a thin film

Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device

EBARA CORP

Plating apparatus

TOKYO SHIBAURA ELECTRIC CO

Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining

HAYASAKA NOBUO

Multichip semiconductor device, chip therefor and method of formation thereof

IBIDEN CO LTD

Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method

SUMITOMO ELECTRIC INDUSTRIES

Contact probe with guide unit and fabrication method thereof