Inventor
LINDGREN PETER J
US28 patents
⚠️ This page may combine multiple inventors who share the name “LINDGREN PETER J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS8722508B2May 13, 2014
Low harmonic RF switch in SOI
IBM23 citations92
US7741226B2Jun 22, 2010
Optimal tungsten through wafer via and process of fabricating same
IBM31 citations90
US9171778B2Oct 27, 2015
Dual-damascene process to fabricate thick wire structure
IBM7 citations84
US6797610B1Sep 28, 2004
Sublithographic patterning using microtrenching
IBM13 citations84
US8039356B2Oct 18, 2011
Through silicon via lithographic alignment and registration
IBM6 citations63
US7859114B2Dec 28, 2010
IC chip and design structure with through wafer vias dishing correction
IBM5 citations63
US7968975B2Jun 28, 2011
Metal wiring structure for integration with through substrate vias
IBM2 citations62
US8748207B2Jun 10, 2014
Hybrid MEMS RF switch and method of fabricating same
IBM0 citations52
COLLINS DAVID S
4 patentsUS8674423B2Mar 18, 2014
Semiconductor structure having vias and high density capacitors
COLLINS DAVID S26 citations92
US8101494B2Jan 24, 2012
Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors
COLLINS DAVID S7 citations83
US8234606B2Jul 31, 2012
Metal wiring structure for integration with through substrate vias
COLLINS DAVID S2 citations61
US8125013B2Feb 28, 2012
Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors
COLLINS DAVID S0 citations48
COOLBAUGH DOUGLAS D
4 patentsUS8236663B2Aug 7, 2012
Dual-damascene process to fabricate thick wire structure
COOLBAUGH DOUGLAS D16 citations92
US8338265B2Dec 25, 2012
Silicided trench contact to buried conductive layer
COOLBAUGH DOUGLAS D7 citations84
US8753950B2Jun 17, 2014
Dual-damascene process to fabricate thick wire structure
COOLBAUGH DOUGLAS D4 citations83
US8872281B2Oct 28, 2014
Silicided trench contact to buried conductive layer
COOLBAUGH DOUGLAS D3 citations58
LINDGREN PETER J
4 patentsUS8445306B2May 21, 2013
Hybrid MEMS RF switch and method of fabricating same
LINDGREN PETER J5 citations83
US8089135B2Jan 3, 2012
Back-end-of-line wiring structures with integrated passive elements and design structures for a radiofrequency integrated circuit
LINDGREN PETER J6 citations72
US8631570B2Jan 21, 2014
Through wafer vias with dishing correction methods
LINDGREN PETER J2 citations62
US8166651B2May 1, 2012
Through wafer vias with dishing correction methods
LINDGREN PETER J1 citations51