Inventor · disambiguated record

Tadao Hirakawa

Also filed as: HIRAKAWA TADAO

1 granted patent·2 citations·filing 1991–1991

17Inventor score

Technology areasH10W

Files withGOTO SEISAKUSHO KK1

Top patents by PatentIndex Score

1 record

018US5151118AMethod for producing a package-type semiconductor assemblyGOTO SEISAKUSHO KK·Filed 1991·Granted Sep 29, 1992·2 cites·4 claims

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