Inventor
DENG HONGYU
US44 patents
⚠️ This page may combine multiple inventors who share the name “DENG HONGYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FINISAR CORP
36 patentsUS7267494B2Sep 11, 2007
Fiber stub for cladding mode coupling reduction
FINISAR CORP143 citations96
US6838689B1Jan 4, 2005
Backside alignment and packaging of opto-electronic devices
FINISAR CORP59 citations96
US6704343B2Mar 9, 2004
High power single mode vertical cavity surface emitting laser
FINISAR CORP45 citations96
US6829281B2Dec 7, 2004
Vertical cavity surface emitting laser using photonic crystals
FINISAR CORP66 citations95
US6810056B1Oct 26, 2004
Single mode vertical cavity surface emitting laser using photonic crystals with a central defect
FINISAR CORP38 citations92
US7901144B2Mar 8, 2011
Optical interconnect solution
FINISAR CORP11 citations84
US7492798B2Feb 17, 2009
Modular transistor outline can with internal components
FINISAR CORP11 citations84
US6744804B2Jun 1, 2004
Edge emitting lasers using photonic crystals
FINISAR CORP17 citations83
US9874704B2Jan 23, 2018
Ferrule assemblies
FINISAR CORP2 citations73
US9772467B2Sep 26, 2017
Hermetically sealing an optical subassembly
FINISAR CORP2 citations73
US7254155B1Aug 7, 2007
High power single mode vertical cavity surface emitting laser
FINISAR CORP7 citations73
US9848498B2Dec 19, 2017
Optoelectronic subassembly with components mounted on top and bottom of substrate
FINISAR CORP2 citations72
US9612414B2Apr 4, 2017
Multi-channel optoelectronic subassemblies
FINISAR CORP2 citations72
US9437912B2Sep 6, 2016
3-D integrated package
FINISAR CORP3 citations72
US9703044B2Jul 11, 2017
Wavelength division multiplexing
FINISAR CORP3 citations69
US10036861B1Jul 31, 2018
Connector assemblies for optoelectronic modules
FINISAR CORP4 citations68
US7983572B2Jul 19, 2011
Electro-absorption modulator integrated with a vertical cavity surface emitting laser
FINISAR CORP6 citations63
US7806602B2Oct 5, 2010
Optical micro-connector
FINISAR CORP5 citations63
US7399124B2Jul 15, 2008
VCSEL on silicon integrated circuit
FINISAR CORP5 citations63
US10952312B2Mar 16, 2021
Communication module packaging
FINISAR CORP0 citations62
US7901145B2Mar 8, 2011
Mini optical subassembly
FINISAR CORP3 citations62
US7668220B2Feb 23, 2010
Single mode vertical cavity surface emitting laser using photonic crystals with a central defect
FINISAR CORP2 citations62
US11418003B2Aug 16, 2022
Chip on carrier
FINISAR CORP0 citations61
US10816739B2Oct 27, 2020
Horizontal flex circuit with resistance weldable cover
FINISAR CORP1 citations61
US10374386B1Aug 6, 2019
Chip on carrier
FINISAR CORP1 citations61
US7972068B2Jul 5, 2011
Header assembly for communications module
FINISAR CORP4 citations57
US7653271B2Jan 26, 2010
Distributed feedback laser array
FINISAR CORP0 citations52
US10342141B2Jul 2, 2019
Optoelectronic subassembly with components mounted on top and bottom of substrate
FINISAR CORP0 citations51
US9912437B2Mar 6, 2018
Optical transmitters
FINISAR CORP0 citations51
US9854687B2Dec 26, 2017
Multi-layer substrates including thin film signal lines
FINISAR CORP0 citations51
US9823430B2Nov 21, 2017
Lens receptacles
FINISAR CORP0 citations51
US7778552B2Aug 17, 2010
Directly modulated laser with integrated optical filter
FINISAR CORP1 citations48
US7738795B2Jun 15, 2010
VCSEL with integrated optical filter
FINISAR CORP0 citations42
US9804349B2Oct 31, 2017
Multi-lens optical components
FINISAR CORP0 citations41
US9686856B2Jun 20, 2017
Transmission lines
FINISAR CORP0 citations40
US7505501B2Mar 17, 2009
Optoelectronic package
FINISAR CORP0 citations35
DENG HONGYU
3 patentsUS8854836B2Oct 7, 2014
Transistor outline can with in-line electrical couplings
DENG HONGYU5 citations68
US9172209B2Oct 27, 2015
Resistive heating element for enabling laser operation
DENG HONGYU3 citations54
US8463132B2Jun 11, 2013
Integrated laser and photodetector chip for an optical subassembly
DENG HONGYU0 citations40