Inventor

MARUSHIMA CHINAMI

JP3 patents

Patents

3 patents

US12456656B2Oct 28, 2025

Multichip interconnect package

IBM0 citations60

US12315775B2May 27, 2025

Underfill vacuum process

IBM0 citations59

US12519061B2Jan 6, 2026

Multichip interconnect package fine jet underfill

IBM0 citations48